Inventor · disambiguated record
Chooi Mei Chong
Also filed as: CHONG CHOOI MEI
14 granted patents·4 pending applications·31 citations·filing 2010–2021
88Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AUSTRIA AG8INFINEON TECHNOLOGIES AG6INFINEON TECHNOLOGIES AUSTRIA2CHONG CHOOI MEI1OTREMBA RALF1
Top patents by PatentIndex Score
18 records- 0187US9515060B2Multi-chip semiconductor power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Dec 6, 2016·7 cites·16 claims
- 0281US8975117B2Semiconductor device using diffusion solderingOTREMBA RALF·Filed 2012·Granted Mar 10, 2015·7 cites·15 claims
- 0378US11088105B2Semiconductor device and method for fabricating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0478US9368435B2Electronic componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 14, 2016·4 cites·26 claims
- 0577US9806029B2Transistor arrangement with semiconductor chips between two substratesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Oct 31, 2017·4 cites·20 claims
- 0675US10147703B2Semiconductor package for multiphase circuitry deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 4, 2018·3 cites·23 claims
- 0772US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 0865US11869865B2Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 9, 2024·0 cites·7 claims
- 0962US8853835B2Chip arrangements, a chip package and a method for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 7, 2014·1 cites·25 claims
- 1061US9041170B2Multi-level semiconductor packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted May 26, 2015·1 cites·6 claims
- 1158US2020083207A1Method of Manufacturing a Multi-Chip Semiconductor Power DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Application pending·0 cites
- 1251US2017047315A1Method of Manufacturing a Multi-Chip Semiconductor Power DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Application pending·0 cites
- 1350US2018158758A1Leadframe and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Application pending·0 cites
- 1447US11211356B2Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 1546US2016056092A1Leadframe and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2015·Application pending·0 cites
- 1641US10699987B2SMD package with flat contacts to prevent bottleneckINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·0 cites·19 claims
- 1734US8836101B2Multi-chip semiconductor packages and assembly thereofCHONG CHOOI MEI·Filed 2010·Granted Sep 16, 2014·0 cites·16 claims
- 1831US10037934B2Semiconductor chip package having contact pins at short side edgesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 31, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →