Inventor · disambiguated record
Cheng-Hsien Chou
Also filed as: CHOU CHENG-HSIEN
136 granted patents·32 pending applications·787 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD94CHOU WEN-SAN34UNIK WORLD IND CO LTD12UNITECH PRINTED CIRCUIT BOARD7UNITED MICROELECTRONICS CORP6
Top patents by PatentIndex Score
168 records- 0199US11046129B2Anti-spray joint structure of connection hose of vehicle air compressorCHOU WEN SAN·Filed 2020·Granted Jun 29, 2021·9 cites·7 claims
- 0299US11046128B2Anti-spray structure for conention of air nozzle of tire of vehicle and conenction hose of air compressorCHOU WEN SAN·Filed 2020·Granted Jun 29, 2021·5 cites·7 claims
- 0399US9437572B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·227 cites·20 claims
- 0498US11715674B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·4 cites·20 claims
- 0598US11610812B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0698US11152276B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·17 cites·20 claims
- 0798US11127635B1Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 21, 2021·12 cites·20 claims
- 0897US11664411B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·4 cites·20 claims
- 0997US11011600B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·5 cites·20 claims
- 1096US11745451B2Device of inflating and repairing broken tire and method of using the sameCHOU WEN SAN·Filed 2022·Granted Sep 5, 2023·2 cites·7 claims
- 1196US11371901B2Pressure gauge capable of releasing pressure safelyCHOU WEN SAN·Filed 2020·Granted Jun 28, 2022·3 cites·7 claims
- 1296US11098841B2Support device for tire sealant inflatorCHOU WEN SAN·Filed 2020·Granted Aug 24, 2021·3 cites·3 claims
- 1396US10043841B1Image sensor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·20 cites·20 claims
- 1496US9704904B2Deep trench isolation structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·22 cites·20 claims
- 1596US7932146B2Metal gate transistor and polysilicon resistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·52 cites·19 claims
- 1695US11600647B2Absorption enhancement structure to increase quantum efficiency of image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·3 cites·20 claims
- 1795US10734285B2Bonding support structure (and related process) for wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·11 cites·20 claims
- 1895US10164001B1Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·11 cites·20 claims
- 1995US10050018B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·12 cites·20 claims
- 2093US10319768B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·6 cites·20 claims
- 2193US9281331B2High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·16 cites·12 claims
- 2293US7834276B2Structure for connecting a USB communication interface in a flash memory card by the height difference of a rigid flexible boardUNITECH PRINTED CIRCUIT BOARD·Filed 2005·Granted Nov 16, 2010·80 cites·8 claims
- 2392US9653507B2Deep trench isolation shrinkage method for enhanced device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·7 cites·21 claims
- 2492US8404535B2Metal gate transistor and method for fabricating the sameYU CHIH-HAO·Filed 2011·Granted Mar 26, 2013·15 cites·16 claims
- 2592US8084824B2Metal gate transistor and method for fabricating the sameYU CHIH-HAO·Filed 2008·Granted Dec 27, 2011·22 cites·6 claims
- 2691US10541297B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·5 cites·20 claims
- 2791US8193050B2Method for fabricating semiconductor structureYU CHIH-HAO·Filed 2010·Granted Jun 5, 2012·12 cites·15 claims
- 2891US7888195B2Metal gate transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Feb 15, 2011·32 cites·11 claims
- 2991US7799630B2Method for manufacturing a CMOS device having dual metal gateUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 21, 2010·22 cites·55 claims
- 3091US2025366255A1Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3191US2025089387A1Methods for manufacturing semiconductor structure and back-side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3290US9960200B1Selective deposition and planarization for a CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·7 cites·20 claims
- 3390US2025098350A1Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3489US11735617B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·1 cites·20 claims
- 3589US9754993B2Deep trench isolations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·5 cites·20 claims
- 3688US11913440B2Fixing device of motor of air compressorCHOU WEN SAN·Filed 2022·Granted Feb 27, 2024·1 cites·5 claims
- 3788US11828278B2Air compressorCHOU WEN SAN·Filed 2022·Granted Nov 28, 2023·1 cites·4 claims
- 3888US11767836B2Air compressorCHOU WEN SAN·Filed 2022·Granted Sep 26, 2023·1 cites·2 claims
- 3988US11705470B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 4088US9006080B2Varied STI liners for isolation structures in image sensing devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·8 cites·20 claims
- 4187US12484325B2Absorption enhancement structure to increase quantum efficiency of image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·21 claims
- 4287US12183761B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 4387USD985623SAir compressorCHOU WEN SAN·Filed 2021·Granted May 9, 2023·10 cites·1 claims
- 4487US10998364B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·1 cites·20 claims
- 4587US10283550B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·3 cites·20 claims
- 4686US12199120B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4786US2025349597A1Image sensor with dual trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4885USD1043760SAir compressorCHOU WEN SAN·Filed 2022·Granted Sep 24, 2024·8 cites·1 claims
- 4984US12433059B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 5084USD1040862SAir compressorCHOU WEN SAN·Filed 2021·Granted Sep 3, 2024·8 cites·1 claims
Showing the top 50 of 168 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →