Inventor · disambiguated record
Chia-Hsing Chou
Also filed as: CHOU CHIA-HSING
6 granted patents·5 pending applications·42 citations·filing 2006–2024
78Inventor score
Files withASUSTEK COMP INC3TAIWAN SEMICONDUCTOR MFG CO LTD3ADVANCED SEMICONDUCTOR ENG2CHOU CHIA-HSING2CYNTEC CO LTD1
Top patents by PatentIndex Score
11 records- 0189US7791881B2Heat-dissipating mechanism for use with memory moduleASUSTEK COMP INC·Filed 2009·Granted Sep 7, 2010·21 cites·8 claims
- 0284US8059403B2Heat dissipation deviceCHOU CHIA-HSING·Filed 2010·Granted Nov 15, 2011·17 cites·9 claims
- 0375US7957141B2Heat-dissipating mechanism for use with memory moduleASUSTEK COMP INC·Filed 2010·Granted Jun 7, 2011·4 cites·10 claims
- 0466US11189654B2Manufacturing methods of semiconductor image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 0564US2024428978A1Magnetic componentCYNTEC CO LTD·Filed 2024·Application pending·0 cites
- 0653US2015361547A1Method and apparatus for cleaning chemical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 0749US2010060379A1Delay line for printed circuit broadASUSTEK COMP INC·Filed 2009·Application pending·0 cites
- 0847US2017250211A1Semiconductor image sensor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
- 0945US7838777B2Signal transmission structure, package structure and bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 23, 2010·0 cites·8 claims
- 1041US8220144B2Method for improving an Electromagnetic bandgap structureCHOU CHIA-HSING·Filed 2008·Granted Jul 17, 2012·0 cites·12 claims
- 1139US2007228578A1Circuit substrateADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →