Inventor · disambiguated record
Chia-Hua Chu
Also filed as: CHU CHIA HUA
187 granted patents·12 pending applications·1,158 citations·filing 2005–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD137TAIWAN SEMICONDUCTOR MFG32CHU CHIA-HUA6LIN CHUNG HSIEN4HEWLETT PACKARD DEVELOPMENT CO3
Top patents by PatentIndex Score
199 records- 0199US9394161B2MEMS and CMOS integration with low-temperature bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 19, 2016·225 cites·20 claims
- 0299US9040334B2MEMS integrated pressure sensor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·68 cites·20 claims
- 0398US9796582B1Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·23 cites·20 claims
- 0498US9695039B1Multi-pressure MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 4, 2017·17 cites·20 claims
- 0598US9630837B1MEMS structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·21 cites·20 claims
- 0698US9233839B2MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·51 cites·17 claims
- 0798US9187317B2MEMS integrated pressure sensor and microphone devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 17, 2015·59 cites·20 claims
- 0898US9085455B2MEMS devices and methods for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·62 cites·21 claims
- 0997US9567209B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·15 cites·20 claims
- 1097US9459234B2CMOS compatible BioFETKALNITSKY ALEXANDER·Filed 2012·Granted Oct 4, 2016·21 cites·16 claims
- 1197US9133017B2MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·49 cites·20 claims
- 1297US9065358B2MEMS structure and method of forming sameTSAI YI HENG·Filed 2011·Granted Jun 23, 2015·51 cites·14 claims
- 1396US9643838B1Semiconductor device and package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 9, 2017·20 cites·20 claims
- 1496US9459224B1Gas sensor, integrated circuit device using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·18 cites·17 claims
- 1596US8987059B2MEMS devices and methods of forming sameLIANG KAI-CHIH·Filed 2012·Granted Mar 24, 2015·46 cites·20 claims
- 1696US8802473B1MEMS integrated pressure sensor devices having isotropic cavities and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·21 cites·20 claims
- 1796US8525278B2MEMS device having chip scale packagingCHU CHIA-HUA·Filed 2011·Granted Sep 3, 2013·32 cites·19 claims
- 1895US11987891B2Sensor in an internet-of-thingsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·1 cites·20 claims
- 1995US9791406B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·5 cites·20 claims
- 2095US8900905B1MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·26 cites·18 claims
- 2194US10508029B2MEMS integrated pressure sensor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·19 claims
- 2293US9260296B2MEMS integrated pressure sensor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 16, 2016·5 cites·20 claims
- 2393US8895360B2Integrated semiconductor device and wafer level method of fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·12 cites·20 claims
- 2493US8486744B2Multiple bonding in wafer level packagingLIN CHUNG-HSIEN·Filed 2010·Granted Jul 16, 2013·11 cites·20 claims
- 2592US9910009B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 6, 2018·3 cites·20 claims
- 2692US9691725B2Integrated semiconductor device and wafer level method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·7 cites·20 claims
- 2791US9386380B2Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 5, 2016·15 cites·20 claims
- 2891US9290376B1MEMS packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 22, 2016·16 cites·20 claims
- 2991US8846416B1Method for forming biochips and biochips with non-organic landings for improved thermal budgetTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
- 3091US8729646B2MEMS devices and methods for forming the sameCHU CHIA-HUA·Filed 2012·Granted May 20, 2014·9 cites·20 claims
- 3190US10715924B2MEMS microphone having diaphragmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·4 cites·20 claims
- 3290US9981841B2MEMS integrated pressure sensor and microphone devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·5 cites·20 claims
- 3390US9260295B2MEMS integrated pressure sensor devices having isotropic cavities and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·8 cites·20 claims
- 3490US9114976B1Semiconductor arrangement with stress release configurationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·8 cites·20 claims
- 3590US8716051B2MEMS device with release apertureLIN CHUNG-HSIEN·Filed 2010·Granted May 6, 2014·7 cites·18 claims
- 3689US10941034B1Particle filter for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·3 cites·20 claims
- 3789US10850976B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
- 3889US10526196B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 3989US9469527B2MEMS pressure sensor and microphone devices having through-vias and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 18, 2016·5 cites·19 claims
- 4088US10513429B2Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·3 cites·20 claims
- 4188US9975762B2Stacked semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 22, 2018·5 cites·20 claims
- 4288US9511997B2MEMS device with a capping substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 6, 2016·4 cites·20 claims
- 4388US9487391B2Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·6 cites·20 claims
- 4488US9029961B2Wafer level method of sealing different pressure levels for MEMS sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 12, 2015·7 cites·20 claims
- 4588US8330559B2Wafer level packagingCHENG CHUN-WEN·Filed 2010·Granted Dec 11, 2012·6 cites·15 claims
- 4688US2025126415A1Mems device with enhanced membrane structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4787US10609463B2Integrated microphone device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 31, 2020·6 cites·20 claims
- 4887US10131541B2MEMS devices having tethering structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·3 cites·20 claims
- 4987US9567210B2Multi-pressure MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·4 cites·20 claims
- 5087US8569808B1Temperature stabilitized MEMSCHEN TUNG-TSUN·Filed 2012·Granted Oct 29, 2013·10 cites·13 claims
Showing the top 50 of 199 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →