Inventor · disambiguated record
Chen-Fu Chu
Also filed as: CHU CHEN-FU
61 granted patents·18 pending applications·521 citations·filing 2006–2024
99Inventor score
Top patents by PatentIndex Score
79 records- 0197US8871547B2Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Oct 28, 2014·23 cites·17 claims
- 0297US7723718B1Epitaxial structure for metal devicesSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted May 25, 2010·29 cites·33 claims
- 0396US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0496US7897420B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS OPTOELECTRONICS CO·Filed 2007·Granted Mar 1, 2011·35 cites·16 claims
- 0596US7687322B1Method for removing semiconductor street materialSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted Mar 30, 2010·22 cites·25 claims
- 0696US7524686B2Method of making light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2007·Granted Apr 28, 2009·48 cites·19 claims
- 0795US7563625B2Method of making light-emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted Jul 21, 2009·36 cites·20 claims
- 0894US10205055B2Light engine arrayHIPHOTON CO LTD·Filed 2017·Granted Feb 12, 2019·20 cites·20 claims
- 0994US8318519B2Method for handling a semiconductor wafer assemblyDOAN TRUNG TRI·Filed 2007·Granted Nov 27, 2012·26 cites·22 claims
- 1093US7759670B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO LT·Filed 2008·Granted Jul 20, 2010·24 cites·16 claims
- 1192US10170671B2Methods of filling a flowable material in a gap of an assembly moduleCHU CHEN FU·Filed 2017·Granted Jan 1, 2019·5 cites·12 claims
- 1292US9831387B2Light engine arrayHIPHOTON CO LTD·Filed 2015·Granted Nov 28, 2017·12 cites·21 claims
- 1392US8685764B2Method to make low resistance contactCHU CHEN-FU·Filed 2007·Granted Apr 1, 2014·24 cites·12 claims
- 1492US8507302B1Wall structures for a semiconductor waferCHU CHEN-FU·Filed 2006·Granted Aug 13, 2013·11 cites·34 claims
- 1591US7452739B2Method of separating semiconductor diesSEMI PHOTONICS CO LTD·Filed 2007·Granted Nov 18, 2008·23 cites·39 claims
- 1690US8003994B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Aug 23, 2011·10 cites·27 claims
- 1789US8450758B2Light emitting diode deviceLIU WEN-HUANG·Filed 2010·Granted May 28, 2013·6 cites·18 claims
- 1889US8143112B1Method for removing semiconductor street materialDOAN TRUNG TRI·Filed 2010·Granted Mar 27, 2012·6 cites·25 claims
- 1986US8124454B1Die separationCHU CHEN-FU·Filed 2006·Granted Feb 28, 2012·6 cites·20 claims
- 2086US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 2185US8778780B1Method for defining semiconductor devicesDOAN TRUNG-TRI·Filed 2006·Granted Jul 15, 2014·8 cites·24 claims
- 2285US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 2383US10910350B2Structure of a semiconductor arrayHIPHOTON CO LTD·Filed 2015·Granted Feb 2, 2021·5 cites·7 claims
- 2481US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 2580US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 2680US10797188B2Optical semiconductor structure for emitting light through apertureHIPHOTON CO LTD·Filed 2015·Granted Oct 6, 2020·3 cites·20 claims
- 2780USD627747SLight emitting diode deviceSEMI LEDS OPTOELECTRONICS CO L·Filed 2010·Granted Nov 23, 2010·27 cites·1 claims
- 2879US8686461B2Light emitting diode (LED) die having stepped substrates and method of fabricationCHU JIUNN-YI·Filed 2011·Granted Apr 1, 2014·5 cites·12 claims
- 2979US7829440B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO LT·Filed 2007·Granted Nov 9, 2010·6 cites·46 claims
- 3078US8921204B2Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulsesSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Dec 30, 2014·4 cites·26 claims
- 3178US8648370B2Wafer-type light emitting device having precisely coated wavelength-converting layerLIU WEN-HUANG·Filed 2011·Granted Feb 11, 2014·3 cites·26 claims
- 3278US2023101190A1Semiconductor continuous array layerCHU CHEN FU·Filed 2022·Application pending·0 cites
- 3377US7968379B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO·Filed 2008·Granted Jun 28, 2011·5 cites·51 claims
- 3475US8283652B2Vertical light emitting diode (VLED) die having electrode frame and method of fabricationCHU CHEN-FU·Filed 2010·Granted Oct 9, 2012·2 cites·23 claims
- 3574US8546818B2Vertical LED with current-guiding structureLIU WEN-HUANG·Filed 2012·Granted Oct 1, 2013·3 cites·9 claims
- 3672US12426410B2Semiconductor components and semiconductor structures and methods of fabricationTSLC CORP·Filed 2020·Granted Sep 23, 2025·0 cites·22 claims
- 3771US2021273146A1Semiconductor continuous array layerCHU CHEN FU·Filed 2021·Application pending·0 cites
- 3870US9343620B2Method for fabricating a light emitting diode (LED) die having protective substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted May 17, 2016·2 cites·14 claims
- 3970US8802469B2Method of fabricating semiconductor die using handling layerCHU CHEN-FU·Filed 2011·Granted Aug 12, 2014·1 cites·37 claims
- 4070US8716041B2Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer pathsSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 6, 2014·2 cites·19 claims
- 4169US8723160B2Light emitting diode (LED) die having peripheral electrode frame and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted May 13, 2014·1 cites·20 claims
- 4267US8614449B1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2006·Granted Dec 24, 2013·2 cites·29 claims
- 4367US8084780B2Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC)DOAN TRUNG TRI·Filed 2009·Granted Dec 27, 2011·4 cites·24 claims
- 4465US12317659B2Method of making a packaged deviceTSLC CORP·Filed 2021·Granted May 27, 2025·0 cites·13 claims
- 4565US11005018B2Semiconductor continuous array layerCHU CHEN FU·Filed 2018·Granted May 11, 2021·0 cites·14 claims
- 4664US8933467B2Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC)DOAN TRUNG TRI·Filed 2011·Granted Jan 13, 2015·2 cites·18 claims
- 4764US2025157859A1Methods for fabricating semiconductor devices by forming and removing epitaxial (epi) structures from an engineered substrateSEMILEDS CORP·Filed 2024·Application pending·0 cites
- 4863US8802465B2Method for handling a semiconductor wafer assemblySEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted Aug 12, 2014·1 cites·10 claims
- 4963US8703515B2Method for guiding current in a light emitting diode (LED) deviceSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Apr 22, 2014·1 cites·8 claims
- 5062US8148733B2Vertical LED with current guiding structureLIU WEN-HUANG·Filed 2011·Granted Apr 3, 2012·1 cites·21 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →