Semiconductor continuous array layer
Abstract
Disclosed is a color emissive LED array having a substantially flat backplane which has circuitry. The color emissive LED array includes a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; The plurality of multi thickness color emissive LED units have a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit. Meanwhile, the substantially flat backplane having circuitry has one or more anode and one or more cathode. Further, the array is attached to the substantially flat backplane having circuitry by using a jointing layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A color emissive LED array comprising:
a substantially flat backplane having circuitry; a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; whereas a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit.
2 . The color emissive LED array according to claim 1 , wherein the substantially flat backplane having circuitry with one or more anode and one or more cathode.
3 . The color emissive LED array according to claim 1 , wherein the array is attached to the substantially flat backplane having circuitry by a jointing layer.
4 . The color emissive LED array according to claim 1 , wherein the first color emissive LED unit is formed by at least one of vertical LED configuration structure or flip chip LED configuration structure.
5 . The color emissive LED array according to claim 1 , wherein the second color emissive LED unit is formed by at least one of vertical LED configuration structure or flip chip LED configuration structure.
6 . The color emissive LED array according to claim 1 , wherein the third color emissive LED unit is formed by at least one of vertical LED configuration structure or flip chip LED configuration structure.
7 . The color emissive LED array according to claim 4 , wherein the first color emissive LED unit comprising a metal base layer and wherein the metal base layer has a magnetic property selected from at least one of Fe, Ni and Co metal.
8 . The color emissive LED array according to claim 5 , wherein the second color emissive LED unit comprising a metal base layer and wherein the metal base layer has a magnetic property selected from at least one of Fe, Ni and Co metal.
9 . The color emissive LED array according to claim 6 , wherein the third color emissive LED unit comprising a metal base layer and wherein the metal base layer has a magnetic property selected from at least one of Fe, Ni and Co metal.
10 . A LED color display comprising a plurality of color LED units bonded to a backplane;
whereas a first color LED unit height is lower than that of other color LED units whereas all color LED units electrically connected to a first electrical polarity electrode of the backplane; an isolation covered on a portion of each color LED unit to electrically isolate a first electrical polarity of the color LED unit from a second electrical polarity of each color LED unit; and a second electrical polarity contact metal layer disposed on a portion of a second polarity semiconductor layer of each color LED unit; and a common conductive second electrical polarity electrode disposed on the isolation to electrically connect the second electrical polarity contact metal layer and a second electrical polarity electrode of the backplane.
11 . The LED color display according to claim 10 , wherein
the first electrical polarity is an anode polarity; and the second electrical polarity is a cathode polarity.
12 . The LED color display according to claim 10 , wherein
the color LED units are formed by at least one of vertical LED configuration structure or flip chip LED configuration structure.
13 . A LED array comprising a plurality of LED units bonded to a backplane;
whereas the LED units electrically connected to a first electrical polarity electrode of the backplane; an isolation covered on a portion of each LED unit to electrically isolate a first electrical polarity of the LED unit from a second electrical polarity of each LED unit; and a second electrical polarity contact metal layer disposed on a portion of a second polarity semiconductor layer of each LED unit; and a common conductive second electrical polarity electrode disposed on the isolation to electrically connect the second electrical polarity contact metal layer and a second electrical polarity electrode of the backplane.
14 . The LED array according to claim 13 , wherein
the first electrical polarity is an anode polarity; and the second electrical polarity is a cathode polarity.
15 . The LED color display according to claim 13 , wherein
the LED units are formed by at least one of vertical LED configuration structure or flip chip LED configuration structure.Join the waitlist — get patent alerts
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