Inventor · disambiguated record
Chee-Yee Chung
Also filed as: CHUNG CHEE · CHUNG CHEE YEE
29 granted patents·4 pending applications·574 citations·filing 1999–2023
97Inventor score
Top patents by PatentIndex Score
33 records- 0197US6346743B1Embedded capacitor assembly in a packageINTEL CORP·Filed 2000·Granted Feb 12, 2002·127 cites·43 claims
- 0295US9966842B1Parallel voltage regulator with switched capacitor or capacitor-inductor blocksGOOGLE INC·Filed 2017·Granted May 8, 2018·22 cites·20 claims
- 0394US10141849B1Multi-phase converterGOOGLE LLC·Filed 2017·Granted Nov 27, 2018·9 cites·9 claims
- 0488US7133294B2Integrated circuit packages with sandwiched capacitorsINTEL CORP·Filed 2005·Granted Nov 7, 2006·16 cites·24 claims
- 0588US6392301B1Chip package and methodINTEL CORP·Filed 1999·Granted May 21, 2002·73 cites·33 claims
- 0686US6559484B1Embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted May 6, 2003·44 cites·30 claims
- 0784US10905038B1Electromagnetic interference (“EMI”) sheet attenuatorsGOOGLE LLC·Filed 2019·Granted Jan 26, 2021·4 cites·20 claims
- 0884US6555920B2Vertical electronic circuit packageINTEL CORP·Filed 2001·Granted Apr 29, 2003·25 cites·20 claims
- 0983US7173329B2Package stiffenerINTEL CORP·Filed 2001·Granted Feb 6, 2007·31 cites·14 claims
- 1083US6558181B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2000·Granted May 6, 2003·30 cites·7 claims
- 1179US10742211B1Power sequencing in an active silicon interposerGOOGLE LLC·Filed 2019·Granted Aug 11, 2020·2 cites·6 claims
- 1276US6636416B2Electronic assembly with laterally connected capacitors and manufacturing methodINTEL CORP·Filed 2001·Granted Oct 21, 2003·19 cites·29 claims
- 1375US6900991B2Electronic assembly with sandwiched capacitors and methods of manufactureINTEL CORP·Filed 2001·Granted May 31, 2005·20 cites·42 claims
- 1475US6509640B1Integral capacitor using embedded enclosure for effective electromagnetic radiation reductionINTEL CORP·Filed 2000·Granted Jan 21, 2003·32 cites·30 claims
- 1571US6428358B1Socket with embedded conductive structure and method of fabrication thereforINTEL CORP·Filed 2000·Granted Aug 6, 2002·13 cites·14 claims
- 1670US6877223B2Method of fabrication for a socket with embedded conductive structureINTEL CORP·Filed 2002·Granted Apr 12, 2005·16 cites·8 claims
- 1769US6717277B2Electrical assembly with vertical multiple layer structureINTEL CORP·Filed 2003·Granted Apr 6, 2004·10 cites·25 claims
- 1869US6680218B2Fabrication method for vertical electronic circuit package and systemINTEL CORP·Filed 2003·Granted Jan 20, 2004·10 cites·21 claims
- 1965US11552634B2Power sequencing in an active silicon interposerGOOGLE LLC·Filed 2020·Granted Jan 10, 2023·0 cites·4 claims
- 2065US6584685B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2001·Granted Jul 1, 2003·10 cites·9 claims
- 2159US7109569B2Dual referenced microstripINTEL CORP·Filed 2003·Granted Sep 19, 2006·8 cites·14 claims
- 2256US10312813B2Multi-phase converterGOOGLE LLC·Filed 2018·Granted Jun 4, 2019·0 cites·9 claims
- 2356US7239524B2Resistive element apparatus and methodINTEL CORP·Filed 2001·Granted Jul 3, 2007·7 cites·18 claims
- 2456US6362438B1Enhanced plated-through hole and via contact designINTEL CORP·Filed 1999·Granted Mar 26, 2002·23 cites·13 claims
- 2555US11948716B1Power modules with elevated inductors and capacitors arranged under the inductorsGOOGLE LLC·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 2654US2025181546A1Scheduling-Based Idle Power Reduction For Machine Learning Accelerator SystemsGOOGLE LLC·Filed 2023·Application pending·0 cites
- 2752US6946824B2Power delivery system having a plurality of stages and method for setting power delivery system parametersINTEL CORP·Filed 2001·Granted Sep 20, 2005·7 cites·53 claims
- 2848US7176565B2Capacitors having separate terminals on three or more sidesINTEL CORP·Filed 2001·Granted Feb 13, 2007·3 cites·7 claims
- 2948US2007120149A1Package stiffenerINTEL CORP·Filed 2007·Application pending·0 cites
- 3047US6657275B1Pad and via placement design for land side capacitorsINTEL CORP·Filed 1999·Granted Dec 2, 2003·13 cites·14 claims
- 3147US2006256502A1Capacitor having separate terminals on three or more sides and methods of fabricationINTEL CORP·Filed 2006·Application pending·0 cites
- 3238US6686819B2Dual referenced microstripINTEL CORP·Filed 2002·Granted Feb 3, 2004·0 cites·17 claims
- 3337US2004125580A1Mounting capacitors under ball grid arrayINTEL CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →