Package stiffener

Abstract

Arrangements are used to supply power to a semiconductor package.

1 . An integrated circuit package comprising: 
 a coreless substrate supporting at least a die; and    a package stiffener mounted at a perimeter of the substrate, and arranged apart from the die on the substrate to deliver low-inductance current to the die, via the substrate, while concurrently providing stiffening support to the substrate.    
   
   
       2 . An integrated circuit package as claimed in  claim 1 , wherein the substrate is in one of a ceramic, a flex, and an integrated circuit printed circuit board carrier package.  
   
   
       3 . An integrated circuit package as claimed in  claim 2 , wherein the substrate is in one of a pinned grid array carrier package, and a ball grid array carrier package.  
   
   
       4 . An integrated circuit package as claimed in  claim 2 , wherein the substrate is in one of a flip chip pin grid array carrier package, and a flip chip ball grid array carrier package.  
   
   
       5 . An integrated circuit package as claimed in  claim 1 , wherein the package stiffener includes one of electrically conductive, insulating, and intermingled electrically conductive and insulating sections, and one of a molded, stamped, etched, extruded and deposited frame, wherein the package stiffener is to withstand temperatures of at least normal integrated circuit operation.  
   
   
       6 . An integrated circuit package as claimed in  claim 1 , wherein the package stiffener includes a copper ring split into a power portion and a ground portion, the power and ground portions separated by at least one insulating coupler, and 
 wherein the split copper ring is mounted on the substrate, via a solder providing a low resistance path to deliver large amounts of current to the substrate and remove heat from the substrate.    
   
   
       7 . An integrated circuit package as claimed in  claim 6 , further comprising a heat spreader plate coupled with the split copper ring and with the die.  
   
   
       8 . An integrated circuit package as claimed in  claim 1 , wherein the package stiffener is to support at least partially a heat sink.  
   
   
       9 . An integrated circuit package as claimed in  claim 1 , wherein the package stiffener includes electrical capacitance.  
   
   
       10 . An integrated circuit package as claimed in  claim 9 , wherein the substrate comprises a plane selected from a group including a power plane and a ground plane, wherein the package stiffener is coupled to the plane of the substrate.  
   
   
       11 . A carrier package comprising 
 a coreless substrate of one of a ceramic, a flex, and an integrated circuit printed circuit board package; and    a perimeter frame attached to a perimeter of the substrate on one of a perimeter-side and a die-side of the substrate, the perimeter frame arranged apart from a die on the coreless substrate,    the perimeter frame arranged to provide an electrical function to the coreless substrate and arranged to substantially stiffen the coreless substrate.    
   
   
       12 . A carrier package as claimed in  claim 11 , wherein the electrical function is one of ground, power, and capacitance.  
   
   
       13 . A carrier package as claimed in  claim 11 , wherein the perimeter frame is attached in multiple parts.  
   
   
       14 . A carrier package as claimed in  claim 13 , wherein the multiple parts are thermally conductive.  
   
   
       15 . A carrier package as claimed in  claim 11 , wherein the frame includes an integrated cooling structure.  
   
   
       16 . A packaged integrated circuit comprising: 
 one of a ceramic, flex, and an integrated circuit printed circuit board carrier package including a coreless substrate; and    a perimeter frame attached to a perimeter of the substrate on one of a perimeter-side and a die-side of the substrate, the perimeter frame arranged apart from a die on the substrate to provide an electrical function to the substrate and arranged to substantially stiffen the coreless substrate.    
   
   
       17 . A packaged integrated circuit as claimed in  claim 16  further comprising a spreader plate that couples the perimeter frame and the die, wherein the perimeter frame and the die are in between the spreader plate and the substrate.  
   
   
       18 . A packaged integrated circuit as claimed in  claim 16  wherein the package stiffener splits into a power portion and a ground portion, wherein the ground portion and the power portion are separated by insulating couplers, wherein the insulating couplers contribute to structural integrity of the perimeter frame.