Inventor · disambiguated record
Chad A. Cobbley
Also filed as: COBBLEY CHAD · COBBLEY CHAD A
123 granted patents·13 pending applications·3,219 citations·filing 1997–2013
99Inventor score
Top patents by PatentIndex Score
136 records- 0198US6343019B1Apparatus and method of stacking die on a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·220 cites·27 claims
- 0297US8344514B2Semiconductor device structures and electronic devices including same hybrid conductive viasMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 1, 2013·34 cites·20 claims
- 0397US6995462B2Image sensor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 7, 2006·89 cites·24 claims
- 0497US6853064B2Semiconductor component having stacked, encapsulated diceMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 8, 2005·102 cites·29 claims
- 0597US6558600B1Method for packaging microelectronic substratesMICRON TECHNOLOGY INC·Filed 2000·Granted May 6, 2003·75 cites·14 claims
- 0697US6184064B1Semiconductor die back side surface and method of fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 6, 2001·157 cites·37 claims
- 0796US7217596B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2004·Granted May 15, 2007·92 cites·15 claims
- 0896US6965160B2Semiconductor dice packages employing at least one redistribution layerMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·102 cites·44 claims
- 0996US6331221B1Process for providing electrical connection between a semiconductor die and a semiconductor die receiving memberMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·192 cites·14 claims
- 1096US6329220B1Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·161 cites·17 claims
- 1195US7227252B2Semiconductor component having stacked, encapsulated dice and method of fabricationMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 5, 2007·27 cites·9 claims
- 1295US6778404B1Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 17, 2004·75 cites·30 claims
- 1395US6533159B1Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in fluxMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 18, 2003·62 cites·15 claims
- 1495US6331453B1Method for fabricating semiconductor packages using mold tooling fixture with flash control cavitiesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·154 cites·25 claims
- 1594US8872310B2Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 28, 2014·13 cites·34 claims
- 1694US7169645B2Methods of fabrication of package assemblies for optically interactive electronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·22 cites·32 claims
- 1794US7026548B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 11, 2006·22 cites·19 claims
- 1894US6897096B2Method of packaging semiconductor dice employing at least one redistribution layerMICRON TECHNOLOGY INC·Filed 2003·Granted May 24, 2005·64 cites·53 claims
- 1994US6572444B1Apparatus and methods of automated wafer-grinding using grinding surface position monitoringMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·56 cites·31 claims
- 2093US7109576B2Semiconductor component having encapsulated die stackMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 19, 2006·53 cites·13 claims
- 2193US6861345B2Method of disposing conductive bumps onto a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 1, 2005·57 cites·24 claims
- 2293US6856009B2Techniques for packaging multiple device componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 15, 2005·54 cites·34 claims
- 2393US6798057B2Thin stacked ball-grid array packageMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 28, 2004·173 cites·13 claims
- 2493US6699928B2Adhesive composition for use in packaging applicationsMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 2, 2004·72 cites·16 claims
- 2593US6268275B1Method of locating conductive spheres utilizing screen and hopper of solder ballsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 31, 2001·62 cites·10 claims
- 2692US7008822B2Method for fabricating semiconductor component having stacked, encapsulated diceMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 7, 2006·51 cites·41 claims
- 2791US8008762B2Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies thereforROUND ROCK RES LLC·Filed 2006·Granted Aug 30, 2011·15 cites·8 claims
- 2891US7101737B2Method of encapsulating interconnecting units in packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 5, 2006·48 cites·16 claims
- 2988US7939449B2Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side endsMICRON TECHNOLOGY INC·Filed 2008·Granted May 10, 2011·12 cites·11 claims
- 3088US6440777B2Method of depositing a thermoplastic polymer in semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·32 cites·24 claims
- 3187US6953891B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 11, 2005·31 cites·48 claims
- 3287US6660558B1Semiconductor package with molded flashMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 9, 2003·39 cites·16 claims
- 3386US6427587B1Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·8 cites·17 claims
- 3486US6329832B1Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·28 cites·14 claims
- 3585US8212348B2Techniques for packaging multiple device componentsBOLKEN TODD O·Filed 2010·Granted Jul 3, 2012·5 cites·16 claims
- 3685US6584897B2Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 1, 2003·21 cites·11 claims
- 3784US8115296B2Electronic device packageBOLKEN TODD O·Filed 2009·Granted Feb 14, 2012·8 cites·22 claims
- 3884US6906403B2Sealed electronic device packages with transparent coveringsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·22 cites·8 claims
- 3984US6682955B2Stacked die module and techniques for forming a stacked die moduleMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 27, 2004·25 cites·11 claims
- 4084US6551917B2Method of locating conductive spheres utilizing screen and hopper of solder ballsMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 22, 2003·22 cites·10 claims
- 4183US7829190B2Electrical interconnect using locally conductive adhesiveMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 9, 2010·3 cites·32 claims
- 4283US7101730B2Method of manufacturing a stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 5, 2006·24 cites·32 claims
- 4382US7459773B2Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·7 cites·13 claims
- 4482US6777071B2Electrical interconnect using locally conductive adhesiveMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 17, 2004·20 cites·18 claims
- 4582US6089151AMethod and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·31 cites·19 claims
- 4681US7179681B2Techniques for packaging multiple device componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 20, 2007·19 cites·9 claims
- 4781US6269742B1Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 7, 2001·8 cites·19 claims
- 4880US7419854B2Methods for packaging image sensitive electronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 2, 2008·5 cites·19 claims
- 4980US6838760B1Packaged microelectronic devices with interconnecting unitsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 4, 2005·22 cites·50 claims
- 5080US6064120AApparatus and method for face-to-face connection of a die face to a substrate with polymer electrodesMICRON TECHNOLOGY INC·Filed 1997·Granted May 16, 2000·39 cites·23 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →