Assignee
BOLKEN TODD O
US·5 granted patents·5 pending applications·16 citations·filing 2004–2012
Top patents by PatentIndex Score
10 records- 0185US8212348B2Techniques for packaging multiple device componentsBOLKEN TODD O·Filed 2010·Granted Jul 3, 2012·5 cites·16 claims
- 0284US8115296B2Electronic device packageBOLKEN TODD O·Filed 2009·Granted Feb 14, 2012·8 cites·22 claims
- 0373US8508034B2Electronic devicesBOLKEN TODD O·Filed 2012·Granted Aug 13, 2013·2 cites·20 claims
- 0467US8426954B2Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies thereforBOLKEN TODD O·Filed 2011·Granted Apr 23, 2013·1 cites·10 claims
- 0554US8629558B2Techniques for packaging multiple device componentsBOLKEN TODD O·Filed 2012·Granted Jan 14, 2014·0 cites·14 claims
- 0651US2006267169A1Image sensitive electronic device packagesBOLKEN TODD O·Filed 2006·Application pending·0 cites
- 0749US2006157838A1Multimedia card and transfer molding methodBOLKEN TODD O·Filed 2006·Application pending·0 cites
- 0849US2006169490A1Molding tool and a method of forming an electronic device packageBOLKEN TODD O·Filed 2006·Application pending·0 cites
- 0938US2006023107A1Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagersBOLKEN TODD O·Filed 2004·Application pending·0 cites
- 1035US2008054429A1Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacersBOLKEN TODD O·Filed 2006·Application pending·0 cites
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