Molding tool and a method of forming an electronic device package

Abstract

Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

1 . A molding tool for an electronic device package housing, comprising: 
 a first platen having a first mold cavity including attachment protrusions for sealing against attachment pads of an interposer; and    a second platen having a second mold cavity including contact protrusions configured to seal against contact pads of the interposer.    
     
     
         2 . The molding tool of  claim 1 , wherein the first mold cavity is configured with a size and a shape to form a housing structure on a chip surface of the interposer.  
     
     
         3 . The molding tool of  claim 1 , further comprising a mold compound within the first mold cavity and the second mold cavity.  
     
     
         4 . The molding tool of  claim 3 , wherein the mold compound comprises a thermoplastic polymer.  
     
     
         5 . The molding tool of  claim 3 , wherein the mold compound comprises one of a thermoset polymer and an epoxy compound.  
     
     
         6 . The molding tool of  claim 3 , further comprising fine silicon particles within the first mold cavity and the second mold cavity.  
     
     
         7 . A method of forming an electronic device package comprising: 
 providing an interposer including a plurality of attachment pads on a first surface thereof and a plurality of contact pads on a second surface thereof;    sealing a first platen of a molding tool against the plurality of attachment pads of the interposer, forming a first mold cavity therein;    sealing a second platen of a molding tool against the plurality of contact pads of the interposer, forming a second mold cavity therein; and    filling the first mold cavity and the second mold cavity with mold compound.    
     
     
         8 . The method of  claim 7 , further comprising at least partially curing the mold compound onto the first surface of the interposer within the molding tool.  
     
     
         9 . The method of  claim 7 , further comprising covering a plurality of edge surfaces of the interposer with the mold compound.  
     
     
         10 . The method of  claim 9 , wherein covering the plurality of edge surfaces comprises: 
 forming a plurality of protrusions extending from the plurality of edge surfaces;    placing the substrate into a mold cavity such that at least some of the plurality of protrusions provide a space between the plurality of edge surfaces and an interior surface of the mold cavity;    filling the space between the plurality of edge surfaces and the interior surface of the mold cavity with a mold compound; and    at least partially curing the mold compound onto the edge surfaces of the substrate.    
     
     
         11 . The method of  claim 10 , wherein filling the space between the plurality of edge surfaces and the interior surface of the mold cavity comprises filling the spaces between at least one tie bar that connects the interposer to another interposer of another electronic device package.  
     
     
         12 . The method of  claim 7 , wherein sealing a first platen of a molding tool against the plurality of attachment pads comprises sealing a protrusion of a plurality of protrusions of the first platen of a molding tool against each attachment pad of the plurality of attachment pads.  
     
     
         13 . The method of  claim 7 , wherein sealing a second platen of a molding tool against the plurality of contact pads comprises sealing a protrusion of a plurality of protrusions of the second platen of a molding tool against each contact pad of the plurality of contact pads.