Inventor · disambiguated record
Todd O. Bolken
Also filed as: BOLKEN TODD · BOLKEN TODD O
95 granted patents·17 pending applications·2,561 citations·filing 1997–2022
99Inventor score
Top patents by PatentIndex Score
112 records- 0198US6462273B1Semiconductor card and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·171 cites·50 claims
- 0297US6995462B2Image sensor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 7, 2006·89 cites·24 claims
- 0397US6853064B2Semiconductor component having stacked, encapsulated diceMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 8, 2005·102 cites·29 claims
- 0496US6444501B1Two stage transfer molding method to encapsulate MMC moduleMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 3, 2002·95 cites·78 claims
- 0596US6329220B1Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·161 cites·17 claims
- 0695US7227252B2Semiconductor component having stacked, encapsulated dice and method of fabricationMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 5, 2007·27 cites·9 claims
- 0795US6778404B1Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 17, 2004·75 cites·30 claims
- 0895US6589820B1Method and apparatus for packaging a microelectronic dieMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 8, 2003·73 cites·6 claims
- 0995US6331453B1Method for fabricating semiconductor packages using mold tooling fixture with flash control cavitiesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·154 cites·25 claims
- 1095US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 1194US7169645B2Methods of fabrication of package assemblies for optically interactive electronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·22 cites·32 claims
- 1294US7026548B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 11, 2006·22 cites·19 claims
- 1393US7109576B2Semiconductor component having encapsulated die stackMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 19, 2006·53 cites·13 claims
- 1493US6856009B2Techniques for packaging multiple device componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 15, 2005·54 cites·34 claims
- 1593US6365434B1Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 2, 2002·67 cites·54 claims
- 1692US7008822B2Method for fabricating semiconductor component having stacked, encapsulated diceMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 7, 2006·51 cites·41 claims
- 1792US6939746B2Method for assembling semiconductor die packages with standard ball grid array footprintMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 6, 2005·36 cites·24 claims
- 1892US6653173B2Method and apparatus for packaging a microelectronic dieMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 25, 2003·48 cites·8 claims
- 1991US8008762B2Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies thereforROUND ROCK RES LLC·Filed 2006·Granted Aug 30, 2011·15 cites·8 claims
- 2091US6644949B2Apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·51 cites·29 claims
- 2191US6638595B2Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·52 cites·13 claims
- 2290US7279366B2Method for assembling semiconductor die packages with standard ball grid array footprintMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 9, 2007·16 cites·26 claims
- 2390US6573592B2Semiconductor die packages with standard ball grid array footprint and method for assembling the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 3, 2003·31 cites·27 claims
- 2490US6400574B1Molded ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·49 cites·23 claims
- 2588US6576496B1Method and apparatus for encapsulating a multi-chip substrate arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·36 cites·130 claims
- 2687US6953891B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 11, 2005·31 cites·48 claims
- 2787US6677675B2Microelectronic devices and microelectronic die packagesMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 13, 2004·32 cites·11 claims
- 2887US6660558B1Semiconductor package with molded flashMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 9, 2003·39 cites·16 claims
- 2985US8212348B2Techniques for packaging multiple device componentsBOLKEN TODD O·Filed 2010·Granted Jul 3, 2012·5 cites·16 claims
- 3085US6734571B2Semiconductor assembly encapsulation moldMICRON TECHNOLOGY INC·Filed 2001·Granted May 11, 2004·32 cites·18 claims
- 3184US8115296B2Electronic device packageBOLKEN TODD O·Filed 2009·Granted Feb 14, 2012·8 cites·22 claims
- 3284US6906403B2Sealed electronic device packages with transparent coveringsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·22 cites·8 claims
- 3384US6033614AManual pellet loader for Boschman automoldsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 7, 2000·41 cites·7 claims
- 3483US7101730B2Method of manufacturing a stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 5, 2006·24 cites·32 claims
- 3583US6963142B2Flip chip integrated package mount supportMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 8, 2005·34 cites·17 claims
- 3683US6538311B2Two-stage transfer molding method to encapsulate MMC moduleMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 25, 2003·22 cites·34 claims
- 3783US6294825B1Asymmetrical mold of multiple-part matrixesMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·56 cites·22 claims
- 3882US7642643B2Apparatus for molding a semiconductor die package with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 5, 2010·8 cites·17 claims
- 3982US7459773B2Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·7 cites·13 claims
- 4081US7179681B2Techniques for packaging multiple device componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 20, 2007·19 cites·9 claims
- 4181US6664139B2Method and apparatus for packaging a microelectronic dieMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 16, 2003·21 cites·7 claims
- 4281US6521980B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·25 cites·12 claims
- 4381US6143581AAsymmetric transfer molding method and an asymmetric encapsulation made therefromMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 7, 2000·41 cites·23 claims
- 4480US7419854B2Methods for packaging image sensitive electronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 2, 2008·5 cites·19 claims
- 4580US6955941B2Methods and apparatus for packaging semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 18, 2005·25 cites·62 claims
- 4680US2023020689A1Semiconductor device assembly with through-package interconnect and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4779US7781875B2Techniques for packaging multiple device componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 24, 2010·5 cites·11 claims
- 4879US6835592B2Methods for molding a semiconductor die package with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·21 cites·30 claims
- 4978US6531763B1Interposers having encapsulant fill control featuresMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·26 cites·75 claims
- 5077US7156633B2Apparatus for encapsulating a multi-chip substrate arrayMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 2, 2007·5 cites·27 claims
Showing the top 50 of 112 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →