Inventor · disambiguated record
Steven W. Heppler
Also filed as: HEPPLER STEVEN W
10 granted patents·1 pending application·504 citations·filing 1992–2012
92Inventor score
Top patents by PatentIndex Score
11 records- 0196US6746894B2Ball grid array interposer, packages and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·249 cites·56 claims
- 0294US7026548B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 11, 2006·22 cites·19 claims
- 0391US5248075AIC pin forming machine with integrated IC testing capabilityMICRON TECHNOLOGY INC·Filed 1992·Granted Sep 28, 1993·98 cites·6 claims
- 0489US6399464B1Packaging die preparationMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·48 cites·33 claims
- 0587US6953891B2Moisture-resistant electronic device package and methods of assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 11, 2005·31 cites·48 claims
- 0684US8115296B2Electronic device packageBOLKEN TODD O·Filed 2009·Granted Feb 14, 2012·8 cites·22 claims
- 0773US8508034B2Electronic devicesBOLKEN TODD O·Filed 2012·Granted Aug 13, 2013·2 cites·20 claims
- 0873US7528007B2Methods for assembling semiconductor devices and interposersMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·5 cites·22 claims
- 0968US7274095B2Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposersMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 25, 2007·12 cites·32 claims
- 1065US6162703APackaging die preparationMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 19, 2000·29 cites·24 claims
- 1149US2006169490A1Molding tool and a method of forming an electronic device packageBOLKEN TODD O·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →