Image sensitive electronic device packages

Abstract

The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.

1 . An electronic device package comprising: 
 a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;    an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;    at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace; and    a shell formed entirely of a transparent material attached to the surface of the carrier substrate, the shell enclosing the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device.    
     
     
         2 . The electronic device package according to  claim 1 , wherein the shell comprises a clear compound adhered to the carrier substrate that contacts and encapsulates the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device.  
     
     
         3 . The electronic device package according to  claim 2 , wherein a surface of the shell is shaped as a lens.  
     
     
         4 . The electronic device package according to  claim 2 , wherein the clear compound is a material selected from a group consisting of epoxy, polystyrene and silicon.  
     
     
         5 . The electronic device package according to  claim 1 , wherein the electronic device comprises an image sensor.  
     
     
         6 . The electronic device package according to  claim 1 , wherein the electronic device comprises a solid-state device selected from a group consisting of a charge coupled device, a complementary metal-oxide semiconductor and an erasable programmable read-only memory.  
     
     
         7 . The electronic device package according to  claim 6 , wherein the electronic device further comprises a chip stack.  
     
     
         8 . The electronic device package according to  claim 1 , wherein the carrier substrate is made of a material selected from a group consisting of plastic, FR-4 and BT.  
     
     
         9 . The electronic device package according to  claim 8 , further comprising: at least one discrete conductive element attached to the second end of the at least one conductive trace of the carrier substrate.  
     
     
         10 . The electronic device package according to  claim 8 , wherein the shell comprises a preformed shell adhesively attached to the carrier substrate and having a cavity enclosing the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device.  
     
     
         11 . An electronic device package comprising: 
 a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;    an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;    at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace;    a transparent lid covering a surface of the electronic device, the transparent lid having edges; and    a layer of molding compound adhered to the carrier substrate, the molding compound contacting and encapsulating the at least one electrical interconnection, a perimeter of the electronic device and the edges of the transparent lid.    
     
     
         12 . The electronic device package according to  claim 11 , wherein the electronic device comprises an image sensor.  
     
     
         13 . The electronic device package according to  claim 11 , wherein the electronic device comprises a solid-state device selected from a group consisting of a charge coupled device, a complementary metal-oxide semiconductor and an erasable programmable read-only memory.  
     
     
         14 . The electronic device package according to  claim 13 , wherein the electronic device further comprises a chip stack.  
     
     
         15 . The electronic device package according to  claim 11 , wherein the carrier substrate is made of a material selected from a group consisting of plastic, FR-4 and BT.  
     
     
         16 . The electronic device package according to  claim 15 , further comprising: at least one solder ball attached to the second end of the at least one conductive trace of the carrier substrate.