Multimedia card and transfer molding method

Abstract

A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.

1 . A packaging method comprising: 
 supplying a substrate in strip form comprising an internal substrate and an external frame connected thereto by at least one connecting segment formed by a peripheral opening, the internal substrate having at least one semiconductor component located on the circuit side thereof connected to external contacts of the internal substrate;    locating at least a portion of the strip in a molding assembly having a molding cavity having internal surfaces in first and second mold plates for moving the internal substrate to a level differing from the level of the external frame;    molding a plastic body on the circuit side of the internal substrate, the body including edge portions formed outwardly from the internal substrate for forming the card, and a plurality of wings extending outwardly from the edge portions; and    removing the molded casting from the molding assembly for separating the internal substrate from the wings.    
   
   
       2 . The method in accordance with  claim 1 , wherein the substrate is moved to a level at which the back side thereof abuts a surface of the molding cavity.  
   
   
       3 . The method in accordance with  claim 1 , wherein the substrate is moved a distance of about 0.2-3 times the substrate thickness.  
   
   
       4 . The method in accordance with  claim 1 , wherein the substrate is moved by movement of pins passing through down-set throughholes in the molding assembly and wings to contact, move and clamp the connecting segments attached to the substrate.  
   
   
       5 . The method in accordance with  claim 1 , wherein portions of the peripheral opening adjacent outer ends of the connecting segments are elongated laterally outward to lengthen the connecting segments.  
   
   
       6 . The method in accordance with  claim 1 , wherein the frame is connected by connecting segments to the substrate on opposing edges thereof.  
   
   
       7 . The method in accordance with  claim 1 , wherein the molding encapsulates the circuit side of the substrate and leaves the external contacts uncovered.  
   
   
       8 . The method in accordance with  claim 4 , wherein the molded casting is removed from the molding assembly by inserting pins into the down-set throughholes to eject the molded casting thereby.  
   
   
       9 . The method in accordance with  claim 4 , wherein the molded casting is removed from the molding assembly by further insertion of the down-set pins through the down-set throughholes to eject the molded casting thereby.  
   
   
       10 . A semiconductor card comprising: 
 a printed circuit substrate having a circuit side, a back side and a peripheral substrate edge having front and back edge corners, the printed circuit substrate including a plurality of conductors on the circuit side and a plurality of external contacts on the back side connected to the plurality of conductors;    at least one semiconductor component on the circuit side connected to the plurality of conductors;    a plastic body molded to the circuit side of the substrate extending laterally from the peripheral substrate edge to form a card having a front face and a back face with a smooth card edge connecting the front and back faces for encapsulating the at least one semiconductor component and the plurality of conductors while leaving the plurality of external contacts exposed; and    a plurality of narrow ends of connecting segments of the printed circuit substrate intersecting with a peripheral edge and exposed therein.    
   
   
       11 . A semiconductor card in accordance with  claim 10 , wherein the back side of the printed circuit substrate is substantially exposed.  
   
   
       12 . A semiconductor card in accordance with  claim 10 , further comprising a cut central portion of the smooth card edge intermediate and separated from the peripheral substrate edge along the front face and the back face.  
   
   
       13 . A semiconductor card in accordance with  claim 10 , wherein the back face is substantially continuously planar.  
   
   
       14 . A semiconductor card in accordance with  claim 10 , wherein the printed circuit substrate comprises a printed circuit board.  
   
   
       15 . A semiconductor card in accordance with  claim 10 , wherein the printed circuit card has a thickness of about 1 mm to about 6 mm.  
   
   
       16 . A semiconductor card in accordance with  claim 10 , wherein the printed circuit substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       17 . A semiconductor card in accordance with  claim 10 , wherein the printed circuit substrate comprises a reinforced organic polymer resin.  
   
   
       18 . A semiconductor card in accordance with  claim 10 , wherein the at least one semiconductor component comprises flash memory.  
   
   
       19 . A semiconductor card in accordance with  claim 10 , wherein the card comprises a memory card for digital recording and retrievably storing data.  
   
   
       20 . A module formed using a semiconductor card having a card outline, the module comprising: 
 a strip of planar insulating material having a circuit side and a back side;    a peripheral opening defining the outer edge of a substrate and the inner edge of a frame, the opening having an inner edge inside of the card outline and an outside edge outside of the card outline; and    a plurality of connecting segments of the strip connecting the substrate to the frame, the connecting segments configured for forced movement to a level different from the frame, wherein the substrate, frame, opening and segments comprise the module.