Inventor · disambiguated record
Charles Cohn
Also filed as: COHN CHARLES · COHN CHARLES E
13 granted patents·2 pending applications·619 citations·filing 1974–2006
93Inventor score
Files withAGERE SYSTEMS INC6AT & T BELL LAB2AGERE SYST GUARDIAN CORP1AMERICAN TELEPHONE & TELEGRAPH1BEGUIN LAURENT1
Top patents by PatentIndex Score
15 records- 0195US5102829APlastic pin grid array packageAT & T BELL LAB·Filed 1991·Granted Apr 7, 1992·266 cites·12 claims
- 0286US4916522AIntegrated circuit package using plastic encapsulantAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Apr 10, 1990·73 cites·4 claims
- 0383US5299090APin-fin heat sinkAT & T BELL LAB·Filed 1993·Granted Mar 29, 1994·86 cites·7 claims
- 0481US7445638B2Humeral implant for shoulder prosthesisBIOMET FRANCE·Filed 2005·Granted Nov 4, 2008·72 cites·8 claims
- 0575US7394028B2Flexible circuit substrate for flip-chip-on-flex applicationsAGERE SYSTEMS INC·Filed 2006·Granted Jul 1, 2008·6 cites·19 claims
- 0674US6790760B1Method of manufacturing an integrated circuit packageAGERE SYSTEMS INC·Filed 2000·Granted Sep 14, 2004·23 cites·16 claims
- 0768US6465882B1Integrated circuit package having partially exposed conductive layerAGERE SYST GUARDIAN CORP·Filed 2000·Granted Oct 15, 2002·16 cites·13 claims
- 0867US6509642B1Integrated circuit packageAGERE SYSTEMS INC·Filed 2000·Granted Jan 21, 2003·14 cites·19 claims
- 0964US5926696ABall grid array plastic packageLUCENT TECHNOLOGIES INC·Filed 1996·Granted Jul 20, 1999·44 cites·9 claims
- 1061US6740222B2Method of manufacturing a printed wiring board having a discontinuous plating layerAGERE SYSTEMS INC·Filed 2001·Granted May 25, 2004·9 cites·16 claims
- 1158US8601683B2Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive materialCOHN CHARLES·Filed 2006·Granted Dec 10, 2013·3 cites·9 claims
- 1257US3943458AReducing gain shifts in photomultiplier tubesUS ENERGY·Filed 1974·Granted Mar 9, 1976·7 cites·5 claims
- 1338US2005150682A1Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive materialAGERE SYSTEMS INC·Filed 2004·Application pending·0 cites
- 1434US2006200248A1Prosthesis for the glenoid cavity of the scapulaBEGUIN LAURENT·Filed 2005·Application pending·0 cites
- 1531US7157361B2Methods for processing integrated circuit packages formed using electroplating and apparatus made therefromAGERE SYSTEMS INC·Filed 2004·Granted Jan 2, 2007·0 cites·27 claims
Join the waitlist — get patent alerts
Get an alert when Charles Cohn files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →