Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material

Abstract

The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

1 . A printed wiring board, comprising: 
 a printed wiring board dielectric layer having a conductive foil located on at least two sides thereof; and    a solid core conductive material located in said printed wire board dielectric layer and interconnecting said conductive foils.    
   
   
       2 . The printed wiring board as recited in  claim 1  wherein said solid core conductive material is a solid core wire.  
   
   
       3 . The printed wiring board as recited in  claim 2  wherein said solid core wire is a solid core copper wire.  
   
   
       4 . The printed wiring board as recited in  claim 1  wherein said solid core conductive material has a diameter ranging from about 0.050 mm to about 0.200 mm.  
   
   
       5 . The printed wiring board as recited in  claim 4  wherein said solid core conductive material has a diameter ranging from about 0.100 mm to about 0.150 mm.  
   
   
       6 . The printed wiring board as recited in  claim 1  wherein said printed wiring board dielectric layer is a first dielectric layer and first and second conductive foils are located on opposing sides thereof, and further including a second dielectric layer and third conductive foil contacting said first conductive foil and a third dielectric layer and a fourth conductive foil contacting said second conductive foil, wherein said solid core conductive material interconnects said first, second, third and fourth conductive foils.  
   
   
       7 . The printed wiring board as recited in  claim 1  wherein said printed wiring board dielectric layer has a thickness ranging from about 0.060 mm to about 0.800 mm and said conductive foils each have a thickness ranging from about 0.005 mm to about 0.075 mm.  
   
   
       8 . A method for manufacturing a printed wiring board, comprising: 
 providing a printed wiring board dielectric layer having conductive foils located on at least two sides thereof;    inserting a solid core conductive material within said printed wiring board dielectric layer, thereby interconnecting said conductive foils.    
   
   
       9 . The method as recited in  claim 8  wherein inserting a solid core conductive material within said printed wiring board dielectric layer includes inserting a solid core wire within said printed wiring board dielectric layer.  
   
   
       10 . The method as recited in  claim 9  wherein inserting a solid core wire within said printed wiring board dielectric layer includes inserting a solid core copper wire within said printed wiring board dielectric layer.  
   
   
       11 . The method as recited in  claim 8  wherein said solid core conductive material has a diameter ranging from about 0.050 mm to about 0.200 mm.  
   
   
       12 . The method as recited in  claim 11  wherein said solid core conductive material has a diameter ranging from about 0.100 mm to about 0.150 mm.  
   
   
       13 . The method as recited in  claim 8  wherein inserting a solid core conductive material within said printed wiring board dielectric layer includes inserting a solid core conductive material within said printed wiring board dielectric layer using a sharp hollow object.  
   
   
       14 . The method as recited in  claim 13  wherein inserting a solid core conductive material within said printed wiring board dielectric layer using a sharp hollow object includes inserting a solid core conductive material within said printed wiring board dielectric layer using a needle.  
   
   
       15 . The method as recited in  claim 8  further including increasing a temperature of said printed wiring board dielectric substrate prior to inserting said solid core conductive material within said printed wiring board dielectric layer.  
   
   
       16 . The method as recited in  claim 15  wherein said temperature ranges from about 50° C. to a temperature less than a glass transition temperature of said printed wiring board dielectric layer.  
   
   
       17 . The method as recited in  claim 8  wherein said printed wiring board dielectric layer is a first dielectric layer and first and second conductive foils are located on opposing sides thereof, and further including forming a second dielectric layer and third conductive foil contacting said first conductive foil and a third dielectric layer and a fourth conductive foil contacting said second conductive foil, wherein said solid core conductive material interconnects said first, second, third and fourth conductive foils.  
   
   
       18 . An electronic subassembly, comprising: 
 a printed wiring board, including;    a printed wiring board dielectric layer having conductive foils located on at least two sides thereof; and    a solid core conductive material located in said printed wiring board dielectric layer and interconnecting said conductive foils; and    electronic components located on one or more surfaces of said printed wiring board.    
   
   
       19 . The electronic subassembly as recited in  claim 18  wherein said solid core conductive material is a solid core wire.  
   
   
       20 . The electronic subassembly as recited in  claim 18  wherein said solid core conductive material has a diameter ranging from about 0.050 mm to about 0.200 mm.