Inventor · disambiguated record
Chandra Deshpandey
Also filed as: DESHPANDEY CHANDRA · DESHPANDEY CHANDRA V
17 granted patents·2 pending applications·1,557 citations·filing 1985–2024
96Inventor score
Files withAPPLIED MATERIALS INC14APPLIED KOMATSU TECHNLOLOGY IN1CHOPRA KASTURI L1UNIV CALIFORNIA1UNIV OF CALIF1
Top patents by PatentIndex Score
19 records- 0197US5592358AElectrostatic chuck for magnetic flux processingAPPLIED MATERIALS INC·Filed 1994·Granted Jan 7, 1997·307 cites·28 claims
- 0296US7544398B1Controlled nano-doping of ultra thin filmsUNIVESITY OF CALIFORNIA·Filed 2006·Granted Jun 9, 2009·433 cites·25 claims
- 0395US5996218AMethod of forming an electrostatic chuck suitable for magnetic flux processingAPPLIED MATERIALS INC·Filed 1996·Granted Dec 7, 1999·160 cites·22 claims
- 0490US5055319AControlled high rate deposition of metal oxide filmsUNIV CALIFORNIA·Filed 1990·Granted Oct 8, 1991·95 cites·20 claims
- 0588US4931158ADeposition of films onto large area substrates using modified reactive magnetron sputteringUNIV OF CALIF·Filed 1989·Granted Jun 5, 1990·82 cites·16 claims
- 0687US5631803AErosion resistant electrostatic chuck with improved cooling systemAPPLIED MATERIALS INC·Filed 1995·Granted May 20, 1997·95 cites·26 claims
- 0786US5822171AElectrostatic chuck with improved erosion resistanceAPPLIED MATERIALS INC·Filed 1995·Granted Oct 13, 1998·74 cites·41 claims
- 0885US5636098ABarrier seal for electrostatic chuckAPPLIED MATERIALS INC·Filed 1995·Granted Jun 3, 1997·85 cites·36 claims
- 0982US6023405AElectrostatic chuck with improved erosion resistanceAPPLIED MATERIALS INC·Filed 1998·Granted Feb 8, 2000·56 cites·42 claims
- 1079US6557248B1Method of fabricating an electrostatic chuckAPPLIED MATERIALS INC·Filed 1998·Granted May 6, 2003·47 cites·9 claims
- 1177US6535372B2Controlled resistivity boron nitride electrostatic chuck apparatus for retaining a semiconductor wafer and method of fabricating the sameAPPLIED MATERIALS INC·Filed 2001·Granted Mar 18, 2003·19 cites·18 claims
- 1276US6436509B1Electrically insulating sealing structure and its method of use in a semiconductor manufacturing apparatusAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·10 cites·37 claims
- 1376US6362097B1Collimated sputtering of semiconductor and other filmsAPPLIED KOMATSU TECHNLOLOGY IN·Filed 1998·Granted Mar 26, 2002·54 cites·30 claims
- 1473US2024376595A1Microstructure control of conducting materials through surface coating of powdersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1567US6033483AElectrically insulating sealing structure and its method of use in a high vacuum physical vapor deposition apparatusAPPLIED MATERIALS INC·Filed 1997·Granted Mar 7, 2000·16 cites·10 claims
- 1662US12084763B2Microstructure control of conducting materials through surface coating of powdersAPPLIED MATERIALS INC·Filed 2021·Granted Sep 10, 2024·0 cites·11 claims
- 1760US6821562B2Method of forming an electrically insulating sealing structure for use in a semiconductor manufacturing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·3 cites·20 claims
- 1849US4714625ADeposition of films of cubic boron nitride and nitrides of other group III elementsCHOPRA KASTURI L·Filed 1985·Granted Dec 22, 1987·21 cites·16 claims
- 1936US2003047283A1Apparatus for supporting a substrate and method of fabricating sameAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →