Inventor · disambiguated record
Charles Franklin Drill
Also filed as: DRILL CHARLES · DRILL CHARLES F · DRILL CHARLES FRANKLIN
12 granted patents·1 pending application·348 citations·filing 1995–2001
93Inventor score
Files withVLSI TECHNOLOGY INC7KONINKL PHILIPS ELECTRONICS NV2VSLI TECHNOLOGY INC2PHILIPS ELECTRONICS NA1
Top patents by PatentIndex Score
13 records- 0187US6241587B1System for dislodging by-product agglomerations from a polishing pad of a chemical mechanical polishing machineVLSI TECHNOLOGY INC·Filed 1998·Granted Jun 5, 2001·74 cites·18 claims
- 0287US6190236B1Method and system for vacuum removal of chemical mechanical polishing by-productsVLSI TECHNOLOGY INC·Filed 1996·Granted Feb 20, 2001·80 cites·19 claims
- 0383US6139428AConditioning ring for use in a chemical mechanical polishing machineVSLI TECHNOLOGY INC·Filed 1996·Granted Oct 31, 2000·60 cites·14 claims
- 0476US6572439B1Customized polishing pad for selective process performance during chemical mechanical polishingKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Jun 3, 2003·15 cites·10 claims
- 0575US5653622AChemical mechanical polishing system and method for optimization and control of film removal uniformityVLSI TECHNOLOGY INC·Filed 1995·Granted Aug 5, 1997·38 cites·8 claims
- 0665US5952241AMethod and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMPVLSI TECHNOLOGY INC·Filed 1997·Granted Sep 14, 1999·24 cites·30 claims
- 0756US6347979B1Slurry dispensing carrier ringVSLI TECHNOLOGY INC·Filed 1998·Granted Feb 19, 2002·19 cites·8 claims
- 0846US6274940B1Semiconductor wafer, a chemical-mechanical alignment mark, and an apparatus for improving alignment for metal masking in conjunction with oxide and tungsten CMPVLSI TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·10 cites·16 claims
- 0942US6413152B1Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and costPHILIPS ELECTRONICS NA·Filed 1999·Granted Jul 2, 2002·9 cites·19 claims
- 1042US6022265AComplementary material conditioning system for a chemical mechanical polishing machineVLSI TECHNOLOGY INC·Filed 1998·Granted Feb 8, 2000·10 cites·15 claims
- 1138US6410440B1Method and apparatus for a gaseous environment providing improved control of CMP processVLSI TECHNOLOGY INC·Filed 1999·Granted Jun 25, 2002·6 cites·14 claims
- 1238US2001012674A1Apparatus for improving alignment for metal maskingFiled 2001·Application pending·0 cites
- 1333US7018282B1Customized polishing pad for selective process performance during chemical mechanical polishingKONINKL PHILIPS ELECTRONICS NV·Filed 1997·Granted Mar 28, 2006·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →