Inventor · disambiguated record
Chun-Chieh Fang
Also filed as: FANG CHUN-CHIEH
13 granted patents·5 pending applications·26 citations·filing 2008–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15FANG CHUN-CHIEH1KUO TSUNG-MIN1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
18 records- 0194US10157944B2CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·14 cites·20 claims
- 0290US10211244B2Image sensor device with reflective structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 19, 2019·5 cites·19 claims
- 0386US10784150B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·3 cites·20 claims
- 0485US2025351607A1Deep trench isolation structures resistant to crackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0580US2025329577A1Semiconductor structure with junction leakage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0678US11990493B2Image sensor device with reflective structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0775US12453203B2Deep trench isolation structures resistant to crackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 0874US11302734B2Deep trench isolation structures resistant to crackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 12, 2022·1 cites·20 claims
- 0971US11342372B2Image sensor device with reflective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 1071US10734427B2Method for forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 1170US12368070B2LDMOS device having isolation regions comprising DTI regions extending from a bottom of STI regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1269US9984918B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·1 cites·17 claims
- 1365US9666619B2CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·1 cites·14 claims
- 1459US10276427B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 1555US7943511B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2009·Granted May 17, 2011·1 cites·12 claims
- 1647US2016372360A1Semiconductor structure with junction leakage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Application pending·0 cites
- 1742US2009190629A1Temperature Sensing Device for Improving Series Resistance Cancellation MechanismFANG CHUN-CHIEH·Filed 2008·Application pending·0 cites
- 1831US2013183801A1Method for manufacturing semiconductor devicesKUO TSUNG-MIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →