Inventor · disambiguated record
Christopher J. Gambee
Also filed as: GAMBEE CHRISTOPHER J
24 granted patents·54 citations·filing 2005–2020
94Inventor score
Top patents by PatentIndex Score
24 records- 0188US10332792B1Methods of fabricating conductive traces and resulting structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 25, 2019·5 cites·22 claims
- 0288US9299663B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 29, 2016·10 cites·17 claims
- 0388US8659153B2Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methodsFAY OWEN R·Filed 2012·Granted Feb 25, 2014·9 cites·29 claims
- 0482US10002840B1Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·3 cites·27 claims
- 0582US9318438B2Semiconductor structures comprising at least one through-substrate via filled with conductive materialsMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 19, 2016·4 cites·20 claims
- 0676US9741612B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
- 0776US7402908B2Intermediate semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 22, 2008·6 cites·14 claims
- 0872US9704781B2Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 11, 2017·3 cites·22 claims
- 0971US10748857B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·1 cites·16 claims
- 1071US9129869B2Pillar on pad interconnect structures, semiconductor devices including same and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 8, 2015·2 cites·24 claims
- 1170US10923478B2Reduction of roughness on a sidewall of an openingMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 16, 2021·1 cites·18 claims
- 1268US10790251B2Methods for enhancing adhesion of three-dimensional structures to substratesMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 29, 2020·1 cites·19 claims
- 1368US8470710B2Methods of forming a metal patternGAMBEE CHRISTOPHER J·Filed 2012·Granted Jun 25, 2013·2 cites·20 claims
- 1467US8329580B2Methods of forming a metal pattern and semiconductor device structureGAMBEE CHRISTOPHER J·Filed 2011·Granted Dec 11, 2012·2 cites·20 claims
- 1564US11302653B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 12, 2022·0 cites·16 claims
- 1663US11276658B2Devices with three-dimensional structures and support elements to increase adhesion to substratesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 15, 2022·0 cites·19 claims
- 1763US8008196B2Method to create a metal pattern using a damascene-like processMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 30, 2011·2 cites·21 claims
- 1862US9034769B2Methods of selectively removing a substrate materialMICRON TECHNOLOGY INC·Filed 2012·Granted May 19, 2015·1 cites·15 claims
- 1958US10896886B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 19, 2021·0 cites·27 claims
- 2058US10811313B2Methods of fabricating conductive traces and resulting structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·18 claims
- 2156US11094684B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 2256US10262961B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·0 cites·27 claims
- 2352US10403618B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·0 cites·17 claims
- 2448US9966347B2Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →