Inventor · disambiguated record
Cheng-Lin Ho
Also filed as: HO CHENG-LIN
33 granted patents·5 pending applications·52 citations·filing 2014–2025
95Inventor score
Top patents by PatentIndex Score
38 records- 0197US11776885B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 3, 2023·4 cites·16 claims
- 0293US10937400B1Cable-driven beater mechanism for percussion instrumentRELIANCE INT CORP·Filed 2020·Granted Mar 2, 2021·4 cites·8 claims
- 0392US11233022B2Electrical connection placement of semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 25, 2022·3 cites·16 claims
- 0492US9460692B2Drum pedal and drum pedal unitRELIANCE INT CORP·Filed 2015·Granted Oct 4, 2016·10 cites·6 claims
- 0590US11680680B1Multi-functional and extendable mounting stand and coupling joint thereofRELIANCE INT CORP·Filed 2022·Granted Jun 20, 2023·4 cites·15 claims
- 0687US2025105122A1Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0785US9420695B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 16, 2016·6 cites·17 claims
- 0884US12165963B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0983US11946591B2Foldable standRELIANCE INT CORP·Filed 2022·Granted Apr 2, 2024·3 cites·12 claims
- 1083US11713843B2Stand adjustment deviceRELIANCE INT CORP·Filed 2021·Granted Aug 1, 2023·2 cites·8 claims
- 1182US11976776B2Stand adjustment deviceRELIANCE INT CORP·Filed 2023·Granted May 7, 2024·1 cites·8 claims
- 1281US11600901B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 7, 2023·2 cites·5 claims
- 1380US12451415B2Semiconductor device package, electronic assembly and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 21, 2025·0 cites·13 claims
- 1478US12224481B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Feb 11, 2025·0 cites·10 claims
- 1578US10334728B2Reduced-dimension via-land structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jun 25, 2019·3 cites·17 claims
- 1677US10734704B2Antenna package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 4, 2020·2 cites·21 claims
- 1776US10636730B2Semiconductor package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 28, 2020·2 cites·17 claims
- 1875US9984898B2Substrate, semiconductor package including the same, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 29, 2018·2 cites·32 claims
- 1974US2025183517A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2072US10665523B2Semiconductor substrate, semiconductor package, and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 26, 2020·1 cites·18 claims
- 2171US11201386B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 14, 2021·1 cites·23 claims
- 2271US11088061B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 10, 2021·0 cites·17 claims
- 2371US10886208B2Semiconductor device package, electronic assembly and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 5, 2021·1 cites·16 claims
- 2469US11764137B2Semiconductor device package, electronic assembly and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 2568US12007063B2Stand adjustment deviceRELIANCE INT CORP·Filed 2023·Granted Jun 11, 2024·0 cites·7 claims
- 2665US11024555B2Semiconductor substrate, semiconductor package, and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 1, 2021·0 cites·19 claims
- 2764US11056435B2Semiconductor package with chamfered padsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 6, 2021·1 cites·25 claims
- 2861US10615109B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Apr 7, 2020·0 cites·14 claims
- 2958US2020258826A1Semiconductor package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 3056US2025384861A1Drum hanger and drum setRELIANCE INT CORP·Filed 2024·Application pending·0 cites
- 3152US2023361014A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 3250US11756904B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 3350US10083902B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 25, 2018·0 cites·21 claims
- 3450US9583427B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 3549US11101186B2Substrate structure having pad portionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 24, 2021·0 cites·14 claims
- 3648US9373601B2Semiconductor substrate, semiconductor package structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 21, 2016·0 cites·20 claims
- 3743US10748843B2Semiconductor substrate including embedded component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 18, 2020·0 cites·20 claims
- 3838US11004779B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 11, 2021·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Cheng-Lin Ho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →