Inventor · disambiguated record
Cheng-Ying Ho
Also filed as: HO CHENG-YING
25 granted patents·10 pending applications·71 citations·filing 2008–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30TAIWAN SEMICONDUCTOR MFG2HO CHENG-YING1SEO HYE-WON1TSAI SHUANG-JI1
Top patents by PatentIndex Score
35 records- 0195US9449914B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·21 cites·20 claims
- 0294US10269768B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·9 cites·20 claims
- 0392US9806119B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·9 cites·20 claims
- 0492US9666566B13DIC structure and method for hybrid bonding semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 0588US2025311462A13dic seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0685US12482791B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 0783US10629568B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·2 cites·20 claims
- 0882US2025366242A1Isolation structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0981US10510792B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·20 claims
- 1080US12396283B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 1180US2025344545A1Back-trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1279US8502389B2CMOS image sensor and method for forming the sameHO CHENG-YING·Filed 2011·Granted Aug 6, 2013·7 cites·20 claims
- 1378US8710612B2Semiconductor device having a bonding pad and shield structure of different thicknessTSAI SHUANG-JI·Filed 2011·Granted Apr 29, 2014·4 cites·12 claims
- 1477US9536920B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 3, 2017·3 cites·20 claims
- 1575US11837595B2Semiconductor device structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 5, 2023·1 cites·20 claims
- 1675US2025318292A1Isolation structure configured to reduce cross talk in image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1771US11923338B2Stacked integrated circuits with redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 1871US9142690B2Semiconductor device having a bonding pad and shield structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 1969US12514009B2Isolation structure configured to reduce cross talk in image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2068US9887182B23DIC structure and method for hybrid bonding semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 6, 2018·1 cites·20 claims
- 2167US2023317758A1Isolation structures in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2266US10297631B2Metal block and bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 21, 2019·1 cites·20 claims
- 2365US11532661B23DIC seal ring structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 2460US10818720B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 2560US2025126914A1Image sensors and methods of manufacturing themTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2660US2025248145A1Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2759US2025151433A1Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2857US10522525B2Semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 2957US9117879B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·0 cites·15 claims
- 3055US2024429258A1Guard ring with deep trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3154US11088192B2Metal block and bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·0 cites·20 claims
- 3254US10283547B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 7, 2019·0 cites·20 claims
- 3353US9818735B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·0 cites·20 claims
- 3451US9437578B2Stacked IC control through the use of homogenous regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·0 cites·20 claims
- 3544US2008178931A1Multi-junction solar cellSEO HYE-WON·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →