Inventor · disambiguated record
Chia-Wei Ho
Also filed as: HO CHIA-WEI
14 granted patents·2 pending applications·35 citations·filing 1997–2023
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10UNITED MICROELECTRONICS CORP3ACCTON TECHNOLOGY CORP1GLOBAL MIXED MODE TECHNOLOGY INC1INTEGRATED CIRCUIT SOLUTION INC1
Top patents by PatentIndex Score
16 records- 0184US11482450B2Methods of forming an abrasive slurry and methods for chemical- mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0278US12224179B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0374US10937691B2Methods of forming an abrasive slurry and methods for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 0471US11637021B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 0569US5921516AFooting structure of a hubACCTON TECHNOLOGY CORP·Filed 1997·Granted Jul 13, 1999·33 cites·1 claims
- 0666US12283329B2Electronic fuse circuit and method for electronic fuse circuitUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 22, 2025·0 cites·17 claims
- 0764US11094555B2CMP slurry and CMP methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 0860US11694756B2Power circuit, electronic fuse circuit, and method for providing power to electronic fuse circuitUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 4, 2023·0 cites·17 claims
- 0960US11037799B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 1059US11121028B2Semiconductor devices formed using multiple planarization processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 1154US10692732B2CMP slurry and CMP methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1253US10636701B2Methods of forming semiconductor devices using multiple planarization processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1345US11133247B2Vias with metal caps for underlying conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 1441US11810643B2Word line driving circuit with high access efficiencyUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 7, 2023·0 cites·10 claims
- 1537US2014337547A1High speed data transmission structureINTEGRATED CIRCUIT SOLUTION INC·Filed 2013·Application pending·0 cites
- 1635US2021297620A1Measurement apparatus for camera moduleGLOBAL MIXED MODE TECHNOLOGY INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →