Inventor · disambiguated record
Chih-Chien Ho
Also filed as: HO CHIH-CHIEN
19 granted patents·5 pending applications·31 citations·filing 2005–2024
91Inventor score
Top patents by PatentIndex Score
24 records- 0191US9627331B1Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 18, 2017·6 cites·20 claims
- 0288US10121733B2Wire support for a leadframeTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 6, 2018·4 cites·34 claims
- 0383US7387484B2Wafer positioning systems and methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 17, 2008·16 cites·13 claims
- 0475US2025096034A1Dam laminate isolation substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0574US9922908B2Semiconductor package having a leadframe with multi-level assembly padsTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 20, 2018·2 cites·9 claims
- 0673US2024194494A1Interconnect singulationTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0768US11908705B2Interconnect singulationTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0868US10395971B2Dam laminate isolation substrateTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 27, 2019·1 cites·18 claims
- 0965US10573581B2LeadframeTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 25, 2020·1 cites·19 claims
- 1064US11342247B2Leadframe with vertically spaced die attach padsTEXAS INSTRUMENTS INC·Filed 2020·Granted May 24, 2022·0 cites·32 claims
- 1161US10811343B2Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 20, 2020·0 cites·8 claims
- 1260US10529654B2Wire support for a leadframeTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 7, 2020·0 cites·17 claims
- 1359US10229868B2Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 12, 2019·0 cites·13 claims
- 1454US2024128094A1Interconnect stripsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1553US10600724B2Leadframe with vertically spaced die attach padsTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 24, 2020·0 cites·22 claims
- 1653US10211132B2Packaged semiconductor device having multi-level leadframes configured as modulesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 19, 2019·0 cites·16 claims
- 1752US8455989B2Package substrate having die pad with outer raised portion and interior recessed portionHO CHIH-CHIEN·Filed 2011·Granted Jun 4, 2013·1 cites·9 claims
- 1852US2019385899A1Dam laminate isolation substrateTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 1950US11817374B2Electronic device with exposed tie barTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 14, 2023·0 cites·23 claims
- 2049US11444012B2Packaged electronic device with split die pad in robust package substrateTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 13, 2022·0 cites·19 claims
- 2147US11081428B2Electronic device with three dimensional thermal padTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·22 claims
- 2247US8546184B2Package substrate having die pad with outer raised portion and interior recessed portionTEXAS INSTRUMENTS INC·Filed 2013·Granted Oct 1, 2013·0 cites·6 claims
- 2346US2023317571A1Lead finger with z-direction obstruction featureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2441US11948721B2Packaged isolation barrier with integrated magneticsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 2, 2024·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Chih-Chien Ho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →