Dam laminate isolation substrate

Abstract

An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.

1 . An apparatus, comprising:
 a first portion of a lead frame, and a second portion of a lead frame, the first portion of the lead frame and the second portion of the lead frame electrically connected to at least a first lead and a second lead of a plurality of leads respectively;   a component bridging a space between the first portion of the lead frame and the second portion of the lead frame; and   an integrated circuit die having a portion on the component.   
     
     
         2 . The apparatus of  claim 1 , further comprising an adhesive in contact with the component, the integrated circuit die and the first portion of the lead frame and the second portion of the lead frame. 
     
     
         3 . The apparatus of  claim 1 , wherein the component is a dry film. 
     
     
         4 . The apparatus of  claim 1 , wherein the component is a solder resist. 
     
     
         5 . The apparatus of  claim 1 , wherein the component is a PSR800 AUS410 film. 
     
     
         6 . The apparatus of  claim 1 , wherein the component is generally between 25 and 30 microns in thickness from a side view of the apparatus. 
     
     
         7 . The apparatus of  claim 1 , wherein the component generally has a T shape from a top view of the apparatus. 
     
     
         8 . The apparatus of  claim 1 , wherein an area of the component is less than an area of the integrated circuit die, from a top view of the apparatus. 
     
     
         9 . The apparatus of  claim 1 , wherein the integrated circuit die overhangs the component on each side of a width dimension of the component. 
     
     
         10 . The apparatus of  claim 1 , wherein the integrated circuit die is electrically connected to at least one of the plurality of leads. 
     
     
         11 . The apparatus of  claim 10 , wherein the first portion of the lead frame and the second portion of the lead frame are electrically isolated from each other. 
     
     
         12 . The apparatus of  claim 1 , wherein the first portion of the lead frame operates at a voltage higher than an operating voltage of the second portion of the lead frame. 
     
     
         13 . The apparatus of  claim 10 , wherein the first portion of the lead frame is a first die attach pad and the second portion of the lead frame is a second die attach pad. 
     
     
         14 . An apparatus, comprising:
 a first portion of a lead frame, and a second portion of a lead frame, the first portion of the lead frame and the second portion of the lead frame electrically connected to at least a first lead and a second lead of a plurality of leads respectively;   a component bridging a space between the first portion of the lead frame and the second portion of the lead frame;   an adhesive in contact with the component; and   an integrated circuit die having a portion on the component and another portion on the adhesive.   
     
     
         15 . The apparatus of  claim 14 , wherein the component is one of a dry film and a solder resist. 
     
     
         16 . The apparatus of  claim 14 , wherein the integrated circuit die is electrically connected to at least one of the plurality of leads. 
     
     
         17 . The apparatus of  claim 14 , further comprising a third portion of the lead frame and a fourth portion of the lead frame electrically isolated from each other. 
     
     
         18 . The apparatus of  claim 17 , wherein the first portion of the lead frame and the third portion of the lead frame are electrically connected to each other, and the second portion of the lead frame and the fourth portion of the lead frame are electrically connected to each other. 
     
     
         19 . The apparatus of  claim 18 , wherein the first portion of the lead frame and the third portion of the lead frame operate at a voltage higher than the second portion of the lead frame and the fourth portion of the lead frame. 
     
     
         20 . The apparatus of  claim 14 , wherein a plane along a surface of the adhesive is coplanar with a plane along a surface of the component.