Inventor · disambiguated record
Chung-Ping Hsia
Also filed as: HSIA CHUNG-PING
1 granted patent·3 pending applications·1 citations·filing 2018–2024
15Inventor score
Top patents by PatentIndex Score
4 records- 0162US10276395B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·1 cites·9 claims
- 0250US2025323172A1Semiconductor structure and method of manufacturing the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0350US2024387395A1Semiconductor device, method of forming the same and method of measuring the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 0444US2024334674A1Semiconductor device and method of forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →