Inventor · disambiguated record
Cheng Yu Hsia
Also filed as: HSIA CHENG-YU
3 granted patents·2 pending applications·9 citations·filing 2006–2025
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0166US8035205B2Molding compound flow controllerSTATS CHIPPAC INC·Filed 2007·Granted Oct 11, 2011·4 cites·64 claims
- 0261US7952209B2Integrated circuit package system with pad to pad bondingSTATS CHIPPAC LTD·Filed 2006·Granted May 31, 2011·5 cites·17 claims
- 0333US2025336777A1Lead framePANJIT ELECTRONICS WUXI CO LTD·Filed 2025·Application pending·0 cites
- 0433US2025336688A1Manufacturing method of no-lead semiconductor package componentPANJIT ELECTRONICS WUXI CO LTD·Filed 2025·Application pending·0 cites
- 0517US8476746B2Package structure enhancing molding compound bondabilityHSIA CHENG-YU·Filed 2010·Granted Jul 2, 2013·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →