Inventor · disambiguated record
Chia-Feng Hsiao
Also filed as: HSIAO CHIA-FENG
2 granted patents·0 citations·filing 2020–2021
23Inventor score
Files withUNITED MICROELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0155US11821847B2Wafer backside defect detection method and wafer backside defect detection apparatusUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 0241US11644427B2Automatic detection method and automatic detection system for detecting crack on wafer edgesUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 9, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →