Inventor · disambiguated record
Ching-Wen Hsiao
Also filed as: HSIAO CHING-WEN
138 granted patents·36 pending applications·1,962 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD73MEDIATEK INC27TAIWAN SEMICONDUCTOR MFG18IND TECH RES INST6HSIAO CHING-WEN5
Top patents by PatentIndex Score
174 records- 0199US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0298US9258922B2PoP structures including through-assembly via modulesCHEN CHIH-HUA·Filed 2012·Granted Feb 9, 2016·54 cites·18 claims
- 0398US9087832B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·54 cites·20 claims
- 0497US11908790B2Chip structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·5 cites·20 claims
- 0597US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 0697US7294920B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2005·Granted Nov 13, 2007·92 cites·5 claims
- 0796US9666522B2Alignment mark design for packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·20 cites·20 claims
- 0896US8928114B2Through-assembly via modules and methods for forming the sameCHEN CHIH-HUA·Filed 2012·Granted Jan 6, 2015·26 cites·20 claims
- 0996US8158489B2Formation of TSV backside interconnects by modifying carrier wafersHUANG HON-LIN·Filed 2010·Granted Apr 17, 2012·47 cites·16 claims
- 1095US11348884B1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·4 cites·20 claims
- 1195US9786632B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Oct 10, 2017·11 cites·32 claims
- 1295US9508674B2Warpage control of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·18 cites·20 claims
- 1395US9035461B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·19 cites·19 claims
- 1495US8318596B2Pillar structure having a non-planar surface for semiconductor devicesKUO TIN-HAO·Filed 2010·Granted Nov 27, 2012·24 cites·22 claims
- 1595US8299616B2T-shaped post for semiconductor devicesCHUANG YAO-CHUN·Filed 2010·Granted Oct 30, 2012·24 cites·20 claims
- 1694US11901323B2Semiconductor packages having conductive pillars with inclined surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 1794US9704836B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·11 cites·41 claims
- 1894US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 1994US8889484B2Apparatus and method for a component packageTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·16 cites·20 claims
- 2094US8803319B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·14 cites·20 claims
- 2194US8736050B2Front side copper post joint structure for temporary bond in TSV applicationHUANG HON-LIN·Filed 2010·Granted May 27, 2014·23 cites·14 claims
- 2294US8653626B2Package structures including a capacitor and methods of forming the sameLO SUT-I·Filed 2012·Granted Feb 18, 2014·51 cites·19 claims
- 2393US10008479B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 26, 2018·5 cites·20 claims
- 2493US9799620B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·9 cites·20 claims
- 2593US8546945B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 1, 2013·12 cites·19 claims
- 2692US10629580B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·4 cites·20 claims
- 2792US10134706B2Warpage control of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·6 cites·20 claims
- 2892US8232643B2Lead free solder interconnections for integrated circuitsCHUANG YAO-CHUN·Filed 2010·Granted Jul 31, 2012·12 cites·20 claims
- 2992US7528009B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2007·Granted May 5, 2009·20 cites·18 claims
- 3091US10483211B2Fan-out package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Nov 19, 2019·8 cites·28 claims
- 3191US10217724B2Semiconductor package assembly with embedded IPDMEDIATEK INC·Filed 2016·Granted Feb 26, 2019·8 cites·25 claims
- 3291US10079192B2Semiconductor chip package assembly with improved heat dissipation performanceMEDIATEK INC·Filed 2016·Granted Sep 18, 2018·8 cites·15 claims
- 3391US10032756B2Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the sameMEDIATEK INC·Filed 2016·Granted Jul 24, 2018·7 cites·22 claims
- 3491US9773749B2Warpage control of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·6 cites·20 claims
- 3591US9576821B2Package structures including a capacitor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·13 cites·19 claims
- 3691US9355933B2Cooling channels in 3DIC stacksTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·9 cites·20 claims
- 3790US10510644B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 3890US10361181B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·4 cites·20 claims
- 3990US9543278B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·4 cites·20 claims
- 4090US9330947B2Methods for forming package-on-package structures having buffer damsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 3, 2016·7 cites·20 claims
- 4189US10692789B2Stacked fan-out package structureMEDIATEK INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 4289US9165887B2Semiconductor device with discrete blocksHSIAO CHING-WEN·Filed 2012·Granted Oct 20, 2015·6 cites·17 claims
- 4388US12452118B2LTF and STF transmission for wide bandwidth 240MHz with more DC tones in wireless communicationsMEDIATEK INC·Filed 2023·Granted Oct 21, 2025·1 cites·18 claims
- 4488US12334476B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 4588US10424563B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2016·Granted Sep 24, 2019·5 cites·29 claims
- 4688US10276525B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·19 claims
- 4787US11488878B2Packaging mechanisms for dies with different sizes of connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·1 cites·20 claims
- 4887US10510727B2Semiconductor device with discrete blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 4987US7411306B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2005·Granted Aug 12, 2008·17 cites·11 claims
- 5086US8921222B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 30, 2014·6 cites·20 claims
Showing the top 50 of 174 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →