Inventor · disambiguated record
Chang-Lin Hsieh
Also filed as: HSIEH CHANG-LIN · HSIEH CHANG-LIN PETER
17 granted patents·6 pending applications·660 citations·filing 1999–2024
94Inventor score
Top patents by PatentIndex Score
23 records- 0193US6949203B2System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 2003·Granted Sep 27, 2005·69 cites·46 claims
- 0293US6762127B2Etch process for dielectric materials comprising oxidized organo silane materialsFiled 2001·Granted Jul 13, 2004·320 cites·28 claims
- 0391US6559942B2Monitoring substrate processing with optical emission and polarized reflected radiationAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·63 cites·21 claims
- 0485US8133819B2Plasma etching carbonaceous layers with sulfur-based etchantsWANG JUDY·Filed 2008·Granted Mar 13, 2012·16 cites·18 claims
- 0584US7244313B1Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination stepsAPPLIED MATERIALS INC·Filed 2006·Granted Jul 17, 2007·11 cites·19 claims
- 0682US6905968B2Process for selectively etching dielectric layersAPPLIED MATERIALS INC·Filed 2001·Granted Jun 14, 2005·27 cites·24 claims
- 0782US6607675B1Method of etching carbon-containing silicon oxide filmsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 19, 2003·29 cites·21 claims
- 0881US6547978B2Method of heating a semiconductor substrateAPPLIED MATERIALS INC·Filed 2001·Granted Apr 15, 2003·26 cites·18 claims
- 0980US6455431B1NH3 plasma descumming and resist stripping in semiconductor applicationsAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·24 cites·22 claims
- 1077US6153530APost-etch treatment of plasma-etched feature surfaces to prevent corrosionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 28, 2000·58 cites·30 claims
- 1170US10630101B2Charging-discharging module of energy storage unit and charging-discharging method thereofASUSTEK COMP INC·Filed 2017·Granted Apr 21, 2020·2 cites·11 claims
- 1265US6897154B2Selective etching of low-k dielectricsAPPLIED MATERIALS INC·Filed 2002·Granted May 24, 2005·12 cites·32 claims
- 1361US11039202B2HDMI apparatus using optical communicationARTILUX INC·Filed 2020·Granted Jun 15, 2021·0 cites·19 claims
- 1460US11500279B2Optical module and projection apparatusCORETRONIC CORP·Filed 2020·Granted Nov 15, 2022·0 cites·12 claims
- 1560US2024385399A1Connector Module for Optical CommunicationARTILUX INC·Filed 2024·Application pending·0 cites
- 1659US11240554B2HDMI apparatus using optical communicationARTILUX INC·Filed 2021·Granted Feb 1, 2022·0 cites·20 claims
- 1748US2008023144A1Dielectric etch tool configured for high density and low bombardment energy plasma providing high etch ratesDELGADINO GERARDO A·Filed 2007·Application pending·0 cites
- 1844US2010024840A1Chamber plasma-cleaning process schemeHSIEH CHANG-LIN·Filed 2008·Application pending·0 cites
- 1943US2009156012A1Method for fabricating low k dielectric dual damascene structuresAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2042US2006118519A1Dielectric etch method with high source and low bombardment plasma providing high etch ratesAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2141US7071112B2BARC shaping for improved fabrication of dual damascene integrated circuit featuresAPPLIED MATERIALS INC·Filed 2002·Granted Jul 4, 2006·3 cites·26 claims
- 2238US7585778B2Method of etching an organic low-k dielectric materialAPPLIED MATERIALS INC·Filed 2007·Granted Sep 8, 2009·0 cites·19 claims
- 2337US2011130007A1In-situ clean to reduce metal residues after etching titanium nitrideAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →