Inventor · disambiguated record
Chang-Hong Hsieh
Also filed as: HSIEH CHANG-HONG
4 granted patents·2 pending applications·9 citations·filing 2013–2020
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0183US9485874B2Package substrate having photo-sensitive dielectric layer and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Nov 1, 2016·7 cites·19 claims
- 0278US10068847B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2017·Granted Sep 4, 2018·2 cites·4 claims
- 0370US11791256B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 0458US10867907B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2018·Granted Dec 15, 2020·0 cites·3 claims
- 0553US2014084413A1Package substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0642US2014117557A1Package substrate and method of forming the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chang-Hong Hsieh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →