Inventor · disambiguated record
Ching-Hsing Hsieh
Also filed as: HSIEH CHING-HSING
14 granted patents·2 pending applications·94 citations·filing 1997–2019
91Inventor score
Top patents by PatentIndex Score
16 records- 0183US11151724B2Automatic detecting method and automatic detecting apparatus using the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·4 cites·20 claims
- 0275US10935969B2Virtual metrology system and methodUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 2, 2021·1 cites·4 claims
- 0369US10261504B2Virtual metrology system and methodUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 16, 2019·2 cites·16 claims
- 0466US7602003B2Semiconductor device structure for reducing hot carrier effect of MOS transistorUNITED MICROELECTRONICS CORP·Filed 2005·Granted Oct 13, 2009·3 cites·12 claims
- 0563US6100183AMethod for fabricating a viaUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Aug 8, 2000·29 cites·19 claims
- 0661US7285491B2Salicide processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Oct 23, 2007·2 cites·8 claims
- 0757US6133143AMethod of manufacturing interconnectUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Oct 17, 2000·22 cites·11 claims
- 0848US7579250B2Method for reducing hot carrier effect of MOS transistorUNITED MICROELECTRONICS CORP·Filed 2007·Granted Aug 25, 2009·0 cites·8 claims
- 0944US7238611B2Salicide processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 3, 2007·0 cites·7 claims
- 1043US2016031056A1Method of fault detection and classification (FDC) for improved tool control capabilitiesUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1142US5960321AMethod of forming a contact viaUNITED MICROELECTRONICS CORP·Filed 1997·Granted Sep 28, 1999·13 cites·9 claims
- 1238US6074941AMethod of forming a via with plasma treatment of SOGUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Jun 13, 2000·7 cites·14 claims
- 1336US6211097B1Planarization processUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 3, 2001·6 cites·6 claims
- 1434US10606253B2Method of monitoring processing system for processing substrateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 31, 2020·0 cites·9 claims
- 1534US6265298B1Method for forming inter-metal dielectricsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 24, 2001·5 cites·5 claims
- 1629US2016274570A1Method of virtual metrology using combined modelsUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →