Inventor · disambiguated record
Che-Wei Hsu
Also filed as: HSU CHE-WEI
116 granted patents·50 pending applications·336 citations·filing 1997–2024
99Inventor score
Files withPHOENIX PIONEER TECHNOLOGY CO LTD38SILICON MOTION INC20TAIWAN SEMICONDUCTOR MFG CO LTD20GIANT MFG CO LTD16PHOENIX & CORP8
Top patents by PatentIndex Score
166 records- 0198US11095221B1Constant on-time controller and buck regulator device using the sameELITE SEMICONDUCTOR MEMORY TECH INC·Filed 2020·Granted Aug 17, 2021·12 cites·18 claims
- 0298US10157834B1Electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0397US11757426B2Manufacturing method for surface acoustic wave filter package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·5 claims
- 0497US11404316B2System, device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·4 cites·20 claims
- 0597US10777518B1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·19 cites·20 claims
- 0696US11488909B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·4 cites·20 claims
- 0796US11329562B1Constant on-time buck converter with improved transient responseELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC·Filed 2020·Granted May 10, 2022·3 cites·5 claims
- 0896US10938402B1Successive approximation register analog-to-digital converterNCKU RES AND DEVELOPMENT FOUNDATION·Filed 2020·Granted Mar 2, 2021·5 cites·11 claims
- 0993US11798909B2Semiconductor package structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·7 claims
- 1093US10672728B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·6 cites·20 claims
- 1192US10088868B1Portable electronic device for acustic imaging and operating method for the sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2018·Granted Oct 2, 2018·13 cites·16 claims
- 1290US11348886B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1390US10734323B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·5 cites·20 claims
- 1489US10475752B2Semiconductor package structure and method of making the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 12, 2019·5 cites·6 claims
- 1589US10300972B2Bicycle seatGIANT MFG CO LTD·Filed 2017·Granted May 28, 2019·5 cites·10 claims
- 1688US7648598B2Manufacturing method for isothermal evaporation casting processUNIV NAT CENTRAL·Filed 2006·Granted Jan 19, 2010·12 cites·12 claims
- 1785US12334457B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 1884US9815161B2Backlash automatic detection system for machine tool and method using the sameIND TECH RES INST·Filed 2014·Granted Nov 14, 2017·7 cites·16 claims
- 1984US9214437B1Package methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Dec 15, 2015·6 cites·9 claims
- 2084US2024387367A1Method of manufacturing electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2183US12088267B2Audio amplifier with duty ratio controlELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC·Filed 2022·Granted Sep 10, 2024·1 cites·12 claims
- 2283US11171088B2Electronic apparatus including antennas and directorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 9, 2021·2 cites·20 claims
- 2383US10117340B2Manufacturing method of package substrate with metal on conductive portionsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Oct 30, 2018·3 cites·5 claims
- 2483US7399399B2Method for manufacturing semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 15, 2008·18 cites·6 claims
- 2581US12218006B2System, device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 2681US9583436B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Granted Feb 28, 2017·5 cites·9 claims
- 2781US2025140610A1System, Device and Methods of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2879US11288182B2Method and computer program product and apparatus for multi-namespace data accessSILICON MOTION INC·Filed 2020·Granted Mar 29, 2022·1 cites·18 claims
- 2978US11929333B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 3078US8545695B2Water provisioning system for kitchenCHEN SHIH-CHANG·Filed 2010·Granted Oct 1, 2013·5 cites·13 claims
- 3177US12341106B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 3277US11742219B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 3377US10002823B2Packaging substrate and method of fabricating the samePHOENIX & CORP·Filed 2017·Granted Jun 19, 2018·2 cites·5 claims
- 3476US11848235B2System, device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 3575US12136593B2Electronic apparatus including antennas and directorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 3675US11121682B1Single-stage boost class-D amplifierELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC·Filed 2020·Granted Sep 14, 2021·1 cites·14 claims
- 3775US8267470B2Positioning device for mounting a seat on a seat tube of a bicycleHSU CHE-WEI·Filed 2009·Granted Sep 18, 2012·9 cites·10 claims
- 3874US10276404B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
- 3974US10162759B2Methods for caching and reading data to be programmed into a storage unit and apparatuses using the sameSILICON MOTION INC·Filed 2017·Granted Dec 25, 2018·1 cites·18 claims
- 4073US11675698B2Apparatus and method and computer program product for handling flash physical-resource setsSILICON MOTION INC·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 4173US9573650B2Hidden hydraulic structure of bike disc brakeGIANT MFG CO LTD·Filed 2015·Granted Feb 21, 2017·2 cites·15 claims
- 4272US12080670B2Manufacturing method of semiconductor package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·9 claims
- 4372US11239096B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 4472US9015936B2Method for manufacturing IC substrateZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Apr 28, 2015·3 cites·13 claims
- 4571US10503600B2Flash memory devices and error-handling methods thereofSILICON MOTION INC·Filed 2018·Granted Dec 10, 2019·1 cites·10 claims
- 4671US9805996B2Substrate structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Oct 31, 2017·2 cites·4 claims
- 4771US8905473B2Seat adjusting moduleHSU CHE-WEI·Filed 2011·Granted Dec 9, 2014·6 cites·10 claims
- 4870US10202158B2Adjustable seat tube structure and bicycleGIANT MFG CO LTD·Filed 2017·Granted Feb 12, 2019·3 cites·19 claims
- 4968US9747206B2Methods for reprogramming data and apparatuses using the sameSILICON MOTION INC·Filed 2015·Granted Aug 29, 2017·2 cites·12 claims
- 5068US9265146B2Method for manufacturing a multi-layer circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 16, 2016·1 cites·12 claims
Showing the top 50 of 166 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →