Inventor · disambiguated record
Ching-Wei Hsu
Also filed as: HSU CHING WEI
8 granted patents·2 pending applications·25 citations·filing 2010–2024
80Inventor score
Files withUNITED MICROELECTRONICS CORP3Chen jia-jia2HON HAI PREC IND CO LTD2HSIEH CHUNG-CHENG2HENGHAO TECH CO LTD1
Top patents by PatentIndex Score
10 records- 0185US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 0278US8254145B2Electronic device with expansion card modulesHSIEH CHUNG-CHENG·Filed 2010·Granted Aug 28, 2012·6 cites·14 claims
- 0377US7990733B2Mounting apparatus for PCI cardHON HAI PREC IND CO LTD·Filed 2010·Granted Aug 2, 2011·5 cites·17 claims
- 0470US8264831B2Mounting apparatus for PCI cardHSIEH CHUNG-CHENG·Filed 2010·Granted Sep 11, 2012·3 cites·16 claims
- 0565US12436654B1Touch panelHENGHAO TECH CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·14 claims
- 0649US9412653B2Through silicon via (TSV) processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·0 cites·11 claims
- 0747US9136170B2Through silicon via (TSV) structure and process thereofChen jia-jia·Filed 2012·Granted Sep 15, 2015·0 cites·8 claims
- 0844US7990721B2Computer system with heat sinkHON HAI PREC IND CO LTD·Filed 2010·Granted Aug 2, 2011·0 cites·17 claims
- 0939US2015093893A1Process of forming seed layer in vertical trench/viaUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1027US2016276215A1Method for Manufacturing Semiconductor DeviceUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →