Inventor · disambiguated record
Ching-Pin Hsu
Also filed as: HSU CHING-PIN
11 granted patents·1 pending application·104 citations·filing 2004–2021
87Inventor score
Files withUNITED MICROELECTRONICS CORP7CHANG FENG-YI2HSU CHING-PIN1PRODISC TECHNOLOGY INC1WISTRON CORP1
Top patents by PatentIndex Score
12 records- 0197US11205609B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·7 cites·13 claims
- 0290US6898030B1Camera lens assemblyPRODISC TECHNOLOGY INC·Filed 2004·Granted May 24, 2005·75 cites·14 claims
- 0385US8785283B2Method for forming semiconductor structure having metal connectionUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jul 22, 2014·8 cites·15 claims
- 0482US9023708B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·6 cites·18 claims
- 0578US8592321B2Method for fabricating an apertureCHANG FENG-YI·Filed 2011·Granted Nov 26, 2013·4 cites·14 claims
- 0673US10290919B2Electronic deviceWISTRON CORP·Filed 2017·Granted May 14, 2019·2 cites·10 claims
- 0763US11848253B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 0861US9337084B1Method for manufacturing contact holes of a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 10, 2016·1 cites·14 claims
- 0957US8252650B1Method for fabricating CMOS transistorCHANG FENG-YI·Filed 2011·Granted Aug 28, 2012·1 cites·15 claims
- 1050US2014038399A1Method for fabricating an apertureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1147US10658173B2Method for fabricating a semiconductor structure on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·0 cites·9 claims
- 1236US8691659B2Method for forming void-free dielectric layerHSU CHING-PIN·Filed 2011·Granted Apr 8, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →