Inventor · disambiguated record
Chia-Kuei Hsu
Also filed as: HSU CHIA-KUEI
60 granted patents·46 pending applications·51 citations·filing 2018–2025
97Inventor score
Top patents by PatentIndex Score
106 records- 0198US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
- 0298US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
- 0397US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
- 0496US12040267B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0595US12300568B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·2 cites·20 claims
- 0695US11798897B2Package structure and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
- 0795US11282756B2Organic interposer including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 0894US11908757B2Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0994US11699668B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 1094US11594477B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 1193US12322703B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 1293US11830800B2Metallization structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 1393US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
- 1493US2025357432A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1591US11610835B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·2 cites·20 claims
- 1687US2024387472A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1787US2025357368A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1886US12489027B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1986US2025349687A1Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2085US12347764B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 2185US2025293143A1Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2284US12444696B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 2384US12132021B2Method for fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 2484US11652037B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 2583US11705420B2Multi-bump connection to interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 2683US2024363511A1Reinforcing Package Using Reinforcing PatchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2783US2024379494A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2883US2024371783A1Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2982US12094810B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 3082US11973001B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 3182US2025300093A1Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3281US12424511B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 3381US12100664B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 3481US2025357292A1Underfill cushion films for packaging substrates and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3581US2025364490A1Multiple non-active dies in a multi-die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3681US2025285958A1Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3781US2025069982A1Semiconductor die package with multi-lid structures and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3880US12512399B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 3980US12341091B2Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 4080US12237277B2Package structure and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 4180US2025364426A1Method of manufacturing semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4280US2025357302A1Method for forming semiconductor package with variable pillar heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4379US12368114B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 4479US12154888B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 4579US12033928B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 4679US11728256B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 4779US2025349728A1Enhanced redistribution via structure for reliability improvement in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4879US2024312887A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4979US2024387405A1Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5079US2025266365A1Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 106 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →