Inventor · disambiguated record
Chin-Teng Hsu
Also filed as: HSU CHIN-TENG
12 granted patents·4 pending applications·61 citations·filing 2001–2019
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD9LIH YEU SENG IND CO LTD5CHANG KUO YUAN1HSU CHIN-TENG1
Top patents by PatentIndex Score
16 records- 0168US8333893B2Filtration separation method for waste resin containing highly radioactive uranium powder and device thereofCHANG KUO-YUAN·Filed 2009·Granted Dec 18, 2012·5 cites·4 claims
- 0266US7416416B1High frequency connectorLIH YEU SENG IND CO LTD·Filed 2007·Granted Aug 26, 2008·11 cites·14 claims
- 0362US7217160B2Adapter for high frequency signal transmissionLIH YEU SENG IND CO LTD·Filed 2006·Granted May 15, 2007·9 cites·11 claims
- 0461US7530842B1High-frequency connector assemblyLIH YEU SENG IND CO LTD·Filed 2008·Granted May 12, 2009·8 cites·7 claims
- 0561US7410835B2Method for fabricating semiconductor package with short-prevented lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Aug 12, 2008·2 cites·6 claims
- 0660US6680531B2Multi-chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 20, 2004·13 cites·12 claims
- 0756US6979886B2Short-prevented lead frame and method for fabricating semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 27, 2005·7 cites·5 claims
- 0846US7126229B2Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Oct 24, 2006·3 cites·9 claims
- 0944US2007007669A1Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 1043US6806565B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Oct 19, 2004·2 cites·8 claims
- 1142US11342704B2Signal connector positioning structure and signal line fabrication methodLIH YEU SENG IND CO LTD·Filed 2019·Granted May 24, 2022·0 cites·4 claims
- 1240US8299977B2Shock- and moisture-resistant connector assemblyHSU CHIN-TENG·Filed 2010·Granted Oct 30, 2012·1 cites·4 claims
- 1338US2017268551A1Hidden Positioning FastenerLIH YEU SENG IND CO LTD·Filed 2016·Application pending·0 cites
- 1437US7008826B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 7, 2006·0 cites·11 claims
- 1537US2005051877A1Semiconductor package having high quantity of I/O connections and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Application pending·0 cites
- 1635US2004217450A1Leadframe-based non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →