Inventor · disambiguated record
Chien-En Hsu
Also filed as: HSU CHIEN-EN
7 granted patents·5 pending applications·65 citations·filing 2005–2022
81Inventor score
Top patents by PatentIndex Score
12 records- 0192US10580823B2Wafer level packaging methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 3, 2020·21 cites·19 claims
- 0290US7602599B1Metal-metal capacitor and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Oct 13, 2009·28 cites·16 claims
- 0383US7732346B2Wet cleaning process and method for fabricating semiconductor device using the sameUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 8, 2010·15 cites·20 claims
- 0469US12148723B2Structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 0564US11557558B2Structure of semiconductor device and method for bonding two substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·6 claims
- 0657US8076207B2Gate structure and method of making the sameKAO CHING-HUNG·Filed 2009·Granted Dec 13, 2011·1 cites·12 claims
- 0752US10804418B2Photodetector and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 13, 2020·0 cites·10 claims
- 0846US2007221618A1Etching methodUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0941US2007138134A1Etching apparatus and etching methodHSIEH CHUAN-HAN·Filed 2005·Application pending·0 cites
- 1032US2016204158A1Complementary metal oxide semiconductor image sensor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1129US2016268230A1Stacked semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1227US2019181119A1Stacked semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →