Inventor · disambiguated record
Chun-Lei Hsu
Also filed as: HSU CHUN-LEI
4 granted patents·2 pending applications·70 citations·filing 2009–2015
77Inventor score
Top patents by PatentIndex Score
6 records- 0195US8981559B2Package on package devices and methods of packaging semiconductor diesHSU CHUN-LEI·Filed 2012·Granted Mar 17, 2015·50 cites·20 claims
- 0292US9257401B2Method of fabricating bump structure and bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 9, 2016·9 cites·20 claims
- 0388US9397080B2Package on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·6 cites·20 claims
- 0479US8993431B2Method of fabricating bump structureHSU CHUN-LEI·Filed 2010·Granted Mar 31, 2015·5 cites·20 claims
- 0555US2010132978A1Whisker-free coating structure and method of fabricating the sameUNIV NAT TAIWAN SCIENCE TECH·Filed 2009·Application pending·0 cites
- 0630US2012177945A1Whisker-Free Coating Structure and Method for Fabricating the SameYEN YEE-WEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →