Inventor · disambiguated record
Ching-Hsiang Hu
Also filed as: HU CHING-HSIANG
16 granted patents·2 pending applications·25 citations·filing 2015–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18
Top patents by PatentIndex Score
18 records- 0194US11782284B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 0292US11726342B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0390US10155656B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·5 cites·20 claims
- 0489US11454820B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·5 cites·20 claims
- 0589US11407636B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·4 cites·20 claims
- 0685US11448891B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·3 cites·20 claims
- 0784US2024361609A1Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0882US12092839B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0982US12054382B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1082US10513432B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1181US12271006B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1281US9884758B2Selective nitride outgassing process for MEMS cavity pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 1378US12157667B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 1478US11305980B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·7 claims
- 1575US12283568B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 1674US11655138B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1773US2025246578A1Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1866US11742320B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →