Inventor · disambiguated record
Chih-Chia Hu
Also filed as: HU CHIH-CHIA
47 granted patents·7 pending applications·153 citations·filing 2017–2025
97Inventor score
Top patents by PatentIndex Score
54 records- 0198US11728247B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·4 cites·14 claims
- 0298US11239205B2Integrating passive devices in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·11 cites·20 claims
- 0398US10157867B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·39 cites·20 claims
- 0497US11735536B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·3 cites·20 claims
- 0597US10312201B1Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·20 cites·20 claims
- 0696US11080455B1Layout design of integrated circuit with through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 3, 2021·4 cites·20 claims
- 0795US11482499B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·3 cites·20 claims
- 0895US10620530B2Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 14, 2020·7 cites·20 claims
- 0994US12223250B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·2 cites·20 claims
- 1094US11094613B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·8 cites·20 claims
- 1194US11088041B2Semiconductor packages with shortened talking pathTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·7 cites·20 claims
- 1294US10535636B2Integrating passive devices in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·10 cites·20 claims
- 1392US11748544B2Method of manufacturing integrated circuit having through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·8 claims
- 1492US11107779B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·5 cites·20 claims
- 1590US10741506B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 1688US11562982B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 24, 2023·4 cites·20 claims
- 1788US10861808B2Bonding structure of dies with dangling bondsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·4 cites·20 claims
- 1888US10515874B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 1987US11574847B2Seal ring between interconnected chips mounted on an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·1 cites·20 claims
- 2087US10996558B2Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·2 cites·20 claims
- 2184US12362261B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2284US10937743B2Mixing organic materials into hybrid packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 2, 2021·3 cites·19 claims
- 2383US12476206B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2483US12113036B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2583US2024371801A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2683US2024377755A1Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2782US12044977B2Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2881US12125820B2Through-dielectric vias for direct connection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·1 cites·20 claims
- 2981US2025364460A1Bonding structure of dies with dangling bondsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3080US11031354B2Mixing organic materials into hybrid packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·2 cites·20 claims
- 3180US2025364464A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3279US12482772B2Bonding structure of dies with dangling bondsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 3379US12080629B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 3479US11854918B2Seal ring between interconnected chips mounted on an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 3579US11791243B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 3679US11756901B2Seal ring for hybrid-bondTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 3778US12170264B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 3878US11726408B2Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 3978US10930580B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·20 claims
- 4078US2025349724A1Method and structure for a bridge interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4177US12293985B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 4277US10510676B2System and method for aligned stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 4375US12154862B2System and method for aligned stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 4475US11916031B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 4574US11462458B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 4, 2022·0 cites·20 claims
- 4674US11402747B2Multiple-mask multiple-exposure lithography and masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 2, 2022·0 cites·20 claims
- 4772US10784219B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 4870US11335656B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 4969US12132029B2Integrating passive devices in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 5067US11908817B2Bonding structure of dies with dangling bondsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →