Inventor · disambiguated record
Cheng-Yen Huang
Also filed as: HUANG CHENG · HUANG CHENG-YEN
15 granted patents·11 pending applications·209 citations·filing 1996–2022
91Inventor score
Files withFARADAY TECH CORP8HUANG CHENG-YEN8CORETRONIC CORP2SONY COMPUTER ENTERTAINMENT INC2UNITED MICROELECTRONICS CORP2
Top patents by PatentIndex Score
26 records- 0195US5594954AKnee-pad and elbow-padFiled 1996·Granted Jan 21, 1997·141 cites·6 claims
- 0293US8379718B2Parallel digital picture encodingSONY COMPUTER ENTERTAINMENT INC·Filed 2009·Granted Feb 19, 2013·28 cites·42 claims
- 0389US8660177B2Parallel entropy codingHUANG CHENG·Filed 2010·Granted Feb 25, 2014·11 cites·29 claims
- 0478US9536159B2Smart glasses and method for recognizing and prompting face using smart glassesCORETRONIC CORP·Filed 2015·Granted Jan 3, 2017·4 cites·12 claims
- 0573US9247248B2Mode searching and early termination of a video picture and fast compression of variable length symbolsSONY COMPUTER ENTERTAINMENT INC·Filed 2013·Granted Jan 26, 2016·2 cites·10 claims
- 0663US9740886B2Enhanced security for hardware decoder acceleratorSONY INTERACTIVE ENTERTAINMENT INC·Filed 2014·Granted Aug 22, 2017·1 cites·27 claims
- 0761US12007902B2Configurable memory system and memory managing method thereofANDES TECH CORPORATION·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 0861US7493600B2Method for verifying branch prediction mechanism and accessible recording medium for storing program thereofFARADAY TECH CORP·Filed 2004·Granted Feb 17, 2009·8 cites·8 claims
- 0958US7701041B2Chip-packaging with bonding options having a plurality of package substratesFARADAY TECH CORP·Filed 2005·Granted Apr 20, 2010·1 cites·6 claims
- 1048US2008003714A1Chip-packaging with bonding options connected to a package substrateHUANG CHENG-YEN·Filed 2007·Application pending·0 cites
- 1145US7057918B2Memory unit and memory module using the sameFARADAY TECH CORP·Filed 2004·Granted Jun 6, 2006·0 cites·13 claims
- 1242US2014032202A1Apparatus of system level simulation and emulation, and associated methodHUANG CHENG-YEN·Filed 2012·Application pending·0 cites
- 1341US7196401B2Chip-packaging with bonding options having a plurality of package substratesFARADAY TECH CORP·Filed 2004·Granted Mar 27, 2007·0 cites·7 claims
- 1441US2013126150A1Fan control system and methodHUANG CHENG-YEN·Filed 2011·Application pending·0 cites
- 1541US2006242368A1Method of Queuing and Related ApparatusHUANG CHENG-YEN·Filed 2005·Application pending·0 cites
- 1640US5983311ASequential memory accessing circuit and method of addressing two memory units using common pointer circuitUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 9, 1999·8 cites·12 claims
- 1739US7463102B2Clock synthesizer with clock divider outside feedback loop and method thereofFARADAY TECH CORP·Filed 2006·Granted Dec 9, 2008·0 cites·23 claims
- 1839US2005248028A1Chip-packaging with bonding options connected to a package substrateHUANG CHENG-YEN·Filed 2004·Application pending·0 cites
- 1939US2012143583A1System-level emulation/verification system and system-level emulation/verification methodHUANG CHENG-YEN·Filed 2010·Application pending·0 cites
- 2037US7375562B2Phase locked system for generating distributed clocksFARADAY TECH CORP·Filed 2005·Granted May 20, 2008·0 cites·14 claims
- 2136US2013128438A1Heat dissipating systemHUANG CHENG-YEN·Filed 2012·Application pending·0 cites
- 2235US2013131885A1System and method for obtaining and managing temperature dataHUANG CHENG-YEN·Filed 2011·Application pending·0 cites
- 2334US2018090110A1Apparatus and method for video frame rotationFARADAY TECH CORP·Filed 2016·Application pending·0 cites
- 2432US2016049135A1Briefing system, wearable device, and note presentation method for briefingCORETRONIC CORP·Filed 2015·Application pending·0 cites
- 2531US5974520AComputer address translation system and method for converting effective or logical address to physical addressUNITED MICROELECTRONICS CORP·Filed 1997·Granted Oct 26, 1999·5 cites·14 claims
- 2630US2008297207A1Double data rate transmitter and clock converter circuit thereofFARADAY TECH CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →