Inventor · disambiguated record
Chih-Hui Huang
Also filed as: HUANG CHIH-HUI
46 granted patents·3 pending applications·885 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
49 records- 0199US9437572B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·227 cites·20 claims
- 0298US11610812B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0398US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 0497US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 0597US9728521B2Hybrid bond using a copper alloy for yield improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·227 cites·20 claims
- 0696US9490158B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·15 cites·20 claims
- 0795US10734285B2Bonding support structure (and related process) for wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·11 cites·20 claims
- 0895US9331032B2Hybrid bonding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·24 cites·20 claims
- 0992US9728570B2Deep trench isolation fabrication for BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·7 cites·20 claims
- 1092US9040385B2Mechanisms for cleaning substrate surface for hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 26, 2015·24 cites·20 claims
- 1191US10134801B2Method of forming deep trench isolation in radiation sensing substrate and image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·7 cites·20 claims
- 1291US9508769B1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 29, 2016·8 cites·20 claims
- 1390US9960200B1Selective deposition and planarization for a CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·7 cites·20 claims
- 1490US8853811B2Image sensor trench isolation with conformal dopingLAI CHIH-YU·Filed 2011·Granted Oct 7, 2014·10 cites·20 claims
- 1589US9837291B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 1688US9754813B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 1785US9190441B2Image sensor trench isolation with conformal dopingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·5 cites·20 claims
- 1884US10504716B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·20 claims
- 1983US10526703B2Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 2083US9842816B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 12, 2017·3 cites·20 claims
- 2183US2024379727A1Method of Forming Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2282US10727097B2Mechanisms for cleaning substrate surface for hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·3 cites·20 claims
- 2382US10475847B2Semiconductor device having stress-neutralized film stack and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 2481US12211741B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2581US2025105056A1Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2680US11041242B2Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·20 claims
- 2779US12142628B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2877US10096515B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 9, 2018·3 cites·20 claims
- 2977US8377733B2Antireflective layer for backside illuminated image sensor and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·1 cites·20 claims
- 3076US11404470B2Method of forming deep trench isolation in radiation sensing substrate and image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 3176US9059057B2Image sensor having compressive layersTSAO CHUN-HAN·Filed 2012·Granted Jun 16, 2015·2 cites·19 claims
- 3275US11862515B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 3374US11087971B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 3474US9252296B2Semiconductor device with compressive layersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 2, 2016·1 cites·20 claims
- 3572US12237165B2Method for wafer bonding including edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 3672US10062656B2Composite bond structure in stacked semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 3771US11915977B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 3866US11387274B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·0 cites·20 claims
- 3966US11276587B2Wafer bonding method and apparatus with curved surfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 4066US11189654B2Manufacturing methods of semiconductor image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 4163US10879288B2Reflector for backside illuminated (BSI) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 4262US10510798B2Method of forming deep trench isolation in radiation sensing substrate and image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4361US11139210B2Bonding support structure (and related process) for wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 4459US10978345B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 13, 2021·0 cites·20 claims
- 4559US10504756B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 4657US10177106B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 4755US10062720B2Deep trench isolation fabrication for BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 4847US2017250211A1Semiconductor image sensor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
- 4941US9859326B2Semiconductor devices, image sensors, and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →