Inventor · disambiguated record
Chen-Chiu Huang
Also filed as: HUANG CHEN-CHIU
22 granted patents·43 pending applications·4 citations·filing 2018–2025
90Inventor score
Top patents by PatentIndex Score
65 records- 0191US11716910B2MRAM structure for balanced loadingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·20 claims
- 0287US12494422B2Semiconductor structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·1 cites·20 claims
- 0384US2025357392A1Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0481US2025359091A1Metal-Insulator-Metal Capacitors And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0580US12444674B2Back-end-of-line passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0680US2024397830A1Magnetic random access memory and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0780US2025357312A1Metal-insulator-metal (mim) capacitors with improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025357202A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0978US2024379531A1Back-end-of-line passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1078US2025357372A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1177US2024379593A1Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US2025357336A1Semiconductor device with seal ring structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1376US11937515B2MRAM structure for balanced loadingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 1476US2024373758A1Magnetic tunnel junction device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1576US2025364397A1Semiconductor packaging structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1676US2025343131A1Semiconductor Structures And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1775US2025343129A1Embedded passive devices for integrated circuits and methods of forming the sameTAIWAN SEMICONDUCTOR MANFACTURING CO LTD·Filed 2025·Application pending·0 cites
- 1875US2025357373A1Passive Device Structure Stress ReductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1974US2024355813A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2074US2024389466A1Semiconductor memory device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2174US2025234568A1Capacitor device with multi-layer dielectric structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2273US11990401B2Back-end-of-line passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2373US2025357309A1Structure and Method for Three-Dimensional Capacitor with Enhanced Packaging Density and Reduced WarpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2472US10811519B2Semiconductor device gate spacer structures and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·1 cites·20 claims
- 2572US2025349627A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2672US2025316628A1Semiconductor structure with bonding interface and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2772US2025301912A1Magnetoresistive Random-Access Memory (MRAM) Structure For Improving Process Control And Method Of Fabricating ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2872US2025300065A1High voltage passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2972US2025149427A1Embedded passive devices for integrated circuits and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3072US2024387617A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3171US2025118683A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3271US2025089277A1Metal-insulator-metal (mim) capacitors with improved reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3370US12382838B2Semiconductor memory device with spacer protection and method for forming same using multi-step patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
- 3470US12087714B2Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 3570US12057445B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 3670US2025149482A1Semiconductor structure with bonding interface and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3769US12082510B2Magnetic tunnel junction device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3869US2024282628A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3969US2025253230A1Structure and Method for Three-Dimensional Capacitor with Enhanced Packaging Density and Reduced WarpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4069US2025038105A1Semiconductor device with seal ring structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4168US12342727B2Magnetoresistive random-access memory (MRAM) structure for improving process control and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 4268US12327785B2High voltage passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 4367US12414477B2Magnetic random access memory and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 4467US12368094B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 4567US2024088204A1Metal-Insulator-Metal Capacitors And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4666US12512433B2Semiconductor structures and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 4766US11664442B2Semiconductor device gate spacer structures and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 30, 2023·0 cites·20 claims
- 4866US2025132208A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4965US12266681B2Capacitor device with multi-layer dielectric structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 5065US2025185262A1Back-end-of-line passive device structure having common connection to groundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →