Inventor · disambiguated record
Chia-Hui Huang
Also filed as: HUANG CHIA-HUI
9 granted patents·3 pending applications·14 citations·filing 2010–2025
80Inventor score
Files withUNITED MICROELECTRONICS CORP6ELITE MATERIAL CO LTD2HUANG TZU-WEI1KENMEC MECH ENGINEERING CO LTD1LIU MING-KAI1
Top patents by PatentIndex Score
12 records- 0183US8251601B2Camera module and method for fabricating the sameHUANG TZU-WEI·Filed 2010·Granted Aug 28, 2012·7 cites·20 claims
- 0281US10668698B2Assembly manufacturing methodELITE MATERIAL CO LTD·Filed 2019·Granted Jun 2, 2020·2 cites·3 claims
- 0381US8557626B2Image sensor devices and methods for manufacturing the sameLIU MING-KAI·Filed 2010·Granted Oct 15, 2013·3 cites·10 claims
- 0472US10340282B1Semiconductor memory device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 0569US8941202B2Image sensor devices and methods for manufacturing the sameVISERA TECHNOLOGIES CO LTD·Filed 2013·Granted Jan 27, 2015·0 cites·9 claims
- 0659US10493727B2Assembly arrangement system and assembly manufacturing methodELITE MATERIAL CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·8 claims
- 0758US2025120087A1Memory structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0856US2025324601A1Manufacturing method of memory structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0953US11725406B2Spraying system and using method thereofKENMEC MECH ENGINEERING CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·8 claims
- 1053US2025113488A1Memory structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1148US11532716B2Non-volatile memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 1240US12119053B2Method of programming MLC memory device and related MLC memory deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 15, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →