Inventor · disambiguated record
Chin-Chun Huang
Also filed as: HUANG CHIN-CHUN
22 granted patents·9 pending applications·131 citations·filing 1992–2023
93Inventor score
Files withUNITED SEMICONDUCTOR XIAMEN CO LTD20HUANG CHIN-CHUN6UNITED MICROELECTRONICS CORP3HUANG JIN-SHU1REALTEK SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
31 records- 0193US11380627B1Radiofrequency deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Jul 5, 2022·7 cites·20 claims
- 0292US11049904B1RRAM structure and method of fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Jun 29, 2021·6 cites·14 claims
- 0386US8207872B2Mechanical keypad with touch pad functionHUANG CHIN-CHUN·Filed 2009·Granted Jun 26, 2012·38 cites·24 claims
- 0483US9664227B2Vacuum retaining device capable of reuseHUANG JIN-SHU·Filed 2016·Granted May 30, 2017·15 cites·7 claims
- 0580US12094820B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·3 claims
- 0677US10937830B2Method of fabricating integrated circuitUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Mar 2, 2021·1 cites·2 claims
- 0773US11749601B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·7 claims
- 0873US9024407B2Monitoring testkey used in semiconductor fabricationHUANG CHIN-CHUN·Filed 2011·Granted May 5, 2015·5 cites·9 claims
- 0971US8441445B2Electrophoretic display keypad structureHUANG CHIN-CHUN·Filed 2010·Granted May 14, 2013·3 cites·18 claims
- 1067US11201116B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·9 claims
- 1164US5228376AScroll sawHUANG CHIN CHUN·Filed 1992·Granted Jul 20, 1993·26 cites·4 claims
- 1259US12094790B2Testkey structure for semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
- 1356US12301268B2Signal predistortion circuit configurationREALTEK SEMICONDUCTOR CORP·Filed 2023·Granted May 13, 2025·0 cites·8 claims
- 1455US12191211B2Method for making semiconductor device using a stress memorization techniqueUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·7 claims
- 1555US2025072077A1Semiconductor device and method of fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 1654US10692929B1Integrated circuit including resistive random-access memory cell and resistor cell and forming method thereofUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·16 claims
- 1754US2025062132A1Etching method of semiconductor structureUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 1854US2025118560A1Method for fabricating semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 1952US12087687B2Semiconductor device and fabrication method thereofUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·9 claims
- 2052US11721599B2Semiconductor testkey pattern and test method thereofUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·11 claims
- 2152US5540130ASaw machineHUANG CHIN CHUN·Filed 1994·Granted Jul 30, 1996·19 cites·4 claims
- 2251US2024222472A1Semiconductor Device and Method of Fabricating the SameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 2350US2024112323A1Method for detecting defects on wafers, system for detecting defects on wafersUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Application pending·0 cites
- 2449US12219886B2Resistive memory deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·13 claims
- 2549US2023402329A1Testkey structure and monitoring method with testkey structureUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Application pending·0 cites
- 2647US11107723B1Method of fabricating semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·13 claims
- 2743US2022148770A1Method for adjusting resistance value of thin film resistance layer in semiconductor structureUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Application pending·0 cites
- 2842US2012301630A1Method for forming flexible printed circuit boardHUANG CHIN-CHUN·Filed 2011·Application pending·0 cites
- 2938US2016133559A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3037US6114196AMethod of fabricating metal-oxide semiconductor transistorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 5, 2000·5 cites·8 claims
- 3134US6376359B1Method of manufacturing metallic interconnectUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 23, 2002·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →