Inventor · disambiguated record
Chun-Jui Huang
Also filed as: HUANG CHUN-JUI
7 granted patents·3 pending applications·2 citations·filing 2018–2024
72Inventor score
Top patents by PatentIndex Score
10 records- 0171US10777455B2Multi-etching process for forming via opening in semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·1 cites·20 claims
- 0271US2023197515A1Via in semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0369US10861745B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 0468US11581222B2Via in semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 0567US12133323B2Transmission device for suppressing glass fiber effectUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 29, 2024·0 cites·10 claims
- 0663US11942367B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·0 cites·20 claims
- 0756US12315981B2Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layerUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 27, 2025·0 cites·17 claims
- 0855US12396096B2Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0955US2023386921A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1053US2025287497A1Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →