Inventor · disambiguated record
Chien-Wen Huang
Also filed as: HUANG CHIEN-WEN
11 granted patents·4 pending applications·51 citations·filing 2011–2021
86Inventor score
Files withPOWERTECH TECHNOLOGY INC5RADIANT INNOVATION INC3INST INFORMATION INDUSTRY2MICRON TECHNOLOGY INC2HAO YAOWU1
Top patents by PatentIndex Score
15 records- 0193US11894327B2Apparatus including integrated segments and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 6, 2024·2 cites·13 claims
- 0292US9223750B2Dynamic tag generating apparatus and dynamic tag generating method thereof for use in display apparatusINST INFORMATION INDUSTRY·Filed 2013·Granted Dec 29, 2015·30 cites·6 claims
- 0388US9412703B1Chip package structure having a shielded molding compoundPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Aug 9, 2016·8 cites·6 claims
- 0481US9825010B2Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 21, 2017·4 cites·18 claims
- 0576US9040157B2Hollow nanoparticles and nanocomposites and methods of making hollow nanoparticles and nanocompositesHAO YAOWU·Filed 2011·Granted May 26, 2015·5 cites·15 claims
- 0672US10431549B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·2 cites·9 claims
- 0757US10950557B2Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Mar 16, 2021·0 cites·13 claims
- 0852US11543298B1Temperature calibration method for a temperature measuring deviceRADIANT INNOVATION INC·Filed 2021·Granted Jan 3, 2023·0 cites·9 claims
- 0948US12068282B2Hybrid metallic structures in stacked semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 20, 2024·0 cites·11 claims
- 1048US10763148B2Semiconductor defects inspection apparatusUTECHZONE CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 1148US2023123056A1Temperature measuring device having a temperature calibration functionRADIANT INNOVATION INC·Filed 2021·Application pending·0 cites
- 1247US12078544B2Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image cameraRADIANT INNOVATION INC·Filed 2020·Granted Sep 3, 2024·0 cites·11 claims
- 1346US2017287870A1Stacked chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1443US2022096009A1Wearable deviceNEW CHINESE BIOTECHNOLOGY CORP LTD·Filed 2020·Application pending·0 cites
- 1533US2016097643A1Mobile navigation system, method and deviceINST INFORMATION INDUSTRY·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →