Inventor · disambiguated record
Chong Chin Hui
Also filed as: HUI CHONG C · HUI CHONG CHIN
19 granted patents·3 pending applications·355 citations·filing 2001–2024
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
22 records- 0196US7205656B2Stacked device package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·58 cites·30 claims
- 0293US6507114B2BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the dieMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·87 cites·35 claims
- 0389US6784525B2Semiconductor component having multi layered leadframeMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 31, 2004·44 cites·43 claims
- 0489US6638792B2Method for fabricating BOC semiconductor packageMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 28, 2003·74 cites·23 claims
- 0587US8125092B2Semiconductor device packages and assembliesCORISIS DAVID J·Filed 2008·Granted Feb 28, 2012·15 cites·22 claims
- 0683US6835599B2Method for fabricating semiconductor component with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 28, 2004·29 cites·22 claims
- 0781US7691682B2Build-up-package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 6, 2010·7 cites·8 claims
- 0880US7425463B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·7 cites·36 claims
- 0976US7846768B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 7, 2010·5 cites·20 claims
- 1071US9673121B2Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2008·Granted Jun 6, 2017·3 cites·25 claims
- 1166US8288859B2Semiconductor device packages including a semiconductor device and a redistribution elementLEE CHOON KUAN·Filed 2011·Granted Oct 16, 2012·1 cites·20 claims
- 1266US7504285B2Carrierless chip package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 17, 2009·2 cites·30 claims
- 1366US6972214B2Method for fabricating a semiconductor package with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 6, 2005·10 cites·21 claims
- 1459US8653625B2Interposer structure with embedded capacitor structure, and methods of making sameHUI CHONG CHIN·Filed 2007·Granted Feb 18, 2014·2 cites·19 claims
- 1559US7816778B2Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 19, 2010·1 cites·19 claims
- 1657US2024282751A1Substrates with downsetMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1756US8749050B2Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elementsMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 10, 2014·0 cites·20 claims
- 1855US6781248B2Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packagedMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·10 cites·113 claims
- 1954US8486825B2Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devicesLEE CHOON KUAN·Filed 2012·Granted Jul 16, 2013·0 cites·19 claims
- 2050US2007216033A1Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2006·Application pending·0 cites
- 2143US8269328B2Stacked die package for peripheral and center device pad layout deviceKIM DALSON YE SENG·Filed 2010·Granted Sep 18, 2012·0 cites·20 claims
- 2232US2002070436A1Die pad for integrated circuitsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →